scia Systems

Chemnitz,
Germany
http://www.scia-systems.com/

小間番号6046

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Empowering Nano Precision with Ion Beam Technologies

scia Systems develops and manufactures equipment with complex plasma and ion beam technologies for ultra-precise surface processing, especially for the MEMS, microelectronics and precision optics industries.

Expertise in microelectronic manufacturing: Coating | Etching | Cleaning

scia Systems provides technologies and process equipment for various microelectronic applications:

Smart sensor technology
e.g., biotechnology sensors, lab-on-chip systems, GMR, TMR, IR sensors
High-frequency electronics
e.g., BAW, SAW
Cost-efficient power electronics
Advanced Silicon & beyond
System Integration by Advanced Electronics Packaging
e.g., multichip packages, SiPs, 3D packaging

Due to their flexible and modular design, the process equipment can be configured according to customer specific requirements, for research applications as well as high volume production in either a "cluster" or "inline" configuration. Our wide range of processing technologies includes etching processes, like Ion Beam Trimming, Ion Beam Milling and Reactive Ion Etching as well as coating processes such as Ion Beam Sputtering, PECVD and Magnetron Sputtering.

出展製品

scia Mill 200

System for full surface ion beam etching and milling of substrates up to 200 mm. A typical application is the structuring of complex multilayers of various materials.... More Info Less Info

The scia Mill 200 is designed to structure complex multilayers of various materials. Different end-point detection systems can be equipped for exact process control. With its fully reactive gas compatibility, the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows it to be adapted as a single substrate version as well as in a high-volume production cluster layout with up to three process chambers and two cassette load locks.

Features & Benefits
•    Etching angle adjustment with a tiltable and rotatable substrate holder
•    Excellent uniformity without shaper
•    Enhanced selectivity and rate with reactive gases

Applications
•    Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
•    Milling of metals in MEMS production (Au, Ru, Ta, …)
•    Milling of multilayers from diversified metal and dielectric materials
•    RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
•    Production of surface relief gratings (SRG)
•    Ion beam smoothing for reduction of microroughness

scia Systems

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