Key features

• Easy to operate stand-alone SCIL imprint tool
• Compact tool with minimal floor space in cleanroom and gray area

• Tri-layer stamp construction allows conformal contact printing even on non-flat surfaces.
• Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles
• Fully automated overlay alignment (same surface and front-to-backside) with better than +/- 1 µm in X,Y
• The excellent etch properties of the sol-gel resist result in high selectivity and etch rates
• The thermal stability, optical transparency and (UV) stability of the sol-gel makes it suitable as functional layer in devices

• Use of NanoGlass sol-gel based imprint material increases stamp lifetime
• Integrated UV curing for UV activated NIL resists
• Imprint system open to all PDMS compatible imprint materials
• Overall combining highest imprint quality and yield with low total cost of ownership

Description

• Tool use designed for SCIL soft-composite-stamp conformal imprinting
• Wafer feed unit.
  • A coated wafer is placed in a holder which ensures centering and aligning towards a notch or flat
  • The wafer is automatically moved into the imprint unit in a reproducible position relative to the stamp (maintaining centering and alignment)
• The overlay alignment, imprint, (UV) curing and stamp release sequence runs fully automatic
• Control software:
  • Fully automatic and semi-automatic mode
  • Individual flow for each substrate for process development or evaluation
  • Library function for recipes and flows
  • All process parameters shown on the touchscreen
  • Real time wafer counter on the touchscreen
  • User management
  • Logging of all relevant process parameters linked to wafer ID
• Error tracking history Remote connection possible for maintenance and error, sensor logging

Key features

• Integration of all essential process steps in one closed coupled system
• Compact tool with minimal floor space in cleanroom and gray area
• Tri-layer stamp construction allows conformal contact printing even on non-flat surfaces
• Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles
• Fully automated overlay alignment (same surface and front-to-backside) with better than +/- 1 µm in X,Y
• The excellent etch properties of the sol-gel resist result in high selectivity and etch rates
• The thermal stability, optical transparency and (UV) stability of the sol-gel makes it suitable as functional layer in devices
• Use of NanoGlass sol-gel based imprint material increases stamp lifetime.
• Integrated UV curing for UV activated NIL resists
• Imprint system open to all PDMS compatible imprint materials
• Overall combining highest imprint quality and yield with low total cost of ownership

Description

• Integrated processes:
  • Robot handling
  • Rotational wafer alignment towards notch or flat
  • Wafer centering
  • Spin-coating
  • Inktjet printing (option)
  • SCIL soft-composite-stamp conformal nano-imprinting
  • Heating plate(s)
  • Cooling plate(s)
• Optional processes:
  • Fully automated overlay alignment
  • UV curing
  • Inktjet printing
  • Scatterometry imprint quality control
• Control software:
  • Fully automatic and semi-automatic mode
  • Individual flow for each substrate or cassette for process development or evaluation
  • Library function for station recipes and flows
  • All process parameters shown on the touchscreen
  • Real time wafer counter on the touchscreen
  • User management
  • Logging of all relevant process parameters linked to wafer ID
  • Error tracking history
• SECS /GEM integration (option)
• Remote connection possibility for maintenance and error, sensor logging

Key features

• Integration of all essential proces steps in one closed coupled system
• Compact tool with minimal floor space in cleanroom and gray area
• Tri-layer stamp construction allows conformal contact printing even on non-flat surfaces
• Unique SCIL imprint process ensures sub 10 nm resolution with low pattern deformation and no stamp damage by particles
• Fully automated overlay alignment (same surface and front-to-backside) with better than +/- 1 µm in X,Y
• The excellent etch properties of the sol-gel resist result in high selectivity and etch rates
• The thermal stability, optical transparency and (UV) stability of the sol-gel makes it suitable as functional layer in devices
• Use of NanoGlass sol-gel based imprint material increases stamp lifetime.
• Integrated UV curing for UV activated NIL resists
• Imprint system open to all compatible imprint material systems
• Overall combining highest imprint quality and yield with low total cost of ownership

Description

• Tool designed for SCIL soft-composite-stamp conformal imprinting
• Integrated processes:
  • Robot handling
  • Rotational wafer alignment towards notch or flat
  • Wafer centering
  • Spin-coating
  • SCIL soft stamp nano-imprinting with overlay alignment better than +/- 1 µm in X,Y
  • UV curing
  • Post cure: heating + cooling plate
• Optional processes that can be integrated:
  • Wafer flipping
  • Wafer buffer
  • Additional spin coater(s)
  • Inktjet printing
  • Additional heating and cooling plates
  • Scatterometry imprint quality control
• Control software:
  • Fully automatic mode
  • Semi-automatic mode for e.g engineering and service
  • Individual flow for each substrate or cassette for process development or evaluation
  • Library function for station recipes and flows
  • User management
  • Logging of all relevant process parameters linked to wafer ID
  • Error tracking history
  • Software package including:
    • Software for recipe writing and system operating (start of handling, first wafer of cassette interlocked until process parameters like hotplate temperature are according to recipe setting)
    • Programmable user levels
    • Logfile storage and management with analyzing tool
    • All process parameter shown on the touchscreen
    • Wafer counter on real time for each wafer on the screen
    • SECS /GEM integration (option)
• Process control computer including system operation HMI
• Touch display for visualization, keyboard, mouse and barcode scanner
• Signal light tower for visual and acoustical system status signals
• Remote connection possibility for maintenance and error, sensor logging