TSI

Shoreview,  MN 
United States
https://tsi.com/semiconductor
  • 小間番号4228


TSI® & MSP, a Division of TSI®, greet you at SEMICON Japan!

Meet Tomorrow's Challenges with Nanoscale Expertise

Welcome to TSI® & MSP, a Division of TSI®, at SEMICON Japan 2024!

We provide essential tools for precision, quality control, and reliability in advanced semiconductor manufacturing. As production scales down, we offer the expertise and solutions needed to stay competitive.

Our key capabilities include:

  • Nanoparticle monitoring in ultra-pure water down to 10 nm
  • Parts cleanliness testing down to 2 nm
  • Particle detection in high-purity gases down to 2 nm
  • Airborne particle counters and monitoring systems down to 10 nm
  • Vapor delivery solutions and Direct Liquid Injection (DLI) tools for thin film deposition
  • Inspection tool calibration down to 10 nm
    • Calibration standards for surface scanning
    • Particle removal efficiency (PRE) challenge wafers
  • Single-particle insights into true CMP slurry size distribution

Stay ahead in semiconductor manufacturing with TSI® and MSP as your trusted partners for overcoming nanoscale challenges.

Join us in envisioning the future at SEMICON Japan 2024.

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 出展製品

  • Nano LPM™ System
    The TSI Nano LPM™ System (Nanoparticle Liquid Particle Monitor) provides true 10 nm nanoparticle detection in semiconductor ultrapure water (UPW). It offers real-time, reliable monitoring, enabling proactive, data-driven decisions....

  • TSI Incorporated, a leader in precision measurement instruments, introduces the Nano LPM™ System (Nanoparticle Liquid Particle Monitor) for true 10 nanometer (nm) particle detection in semiconductor ultrapure water (UPW). The Nano LPM provides continuous monitoring of UPW quality, enabling engineering and quality control teams to make confident, real-time, data-driven decisions.

    Addressing UPW Monitoring Challenges

    UPW is critical in semiconductor manufacturing, used for cleaning wafers, etching, and removing contaminants. Particles as small as 10 nm can impact yield and product quality, making nanoparticle detection essential. Traditional optical-based technologies struggle with detection below 20 nm due to refractive index issues and interference from microbubbles, leading to false readings. TSI’s Nano LPM™ System overcomes these limitations, reliably detecting nanoparticles down to 10 nm and offering real-time insights into UPW quality changes.

    Patented Technology — Aerosolizing the Particles

    The Nano LPM™ sets a new benchmark in UPW monitoring with its patented particle generator that aerosolizes the water, leaving behind solid nanoparticles for analysis. These particles are then measured using a Water-Based Condensation Particle Counter (CPC) designed for cleanroom environments. This process ensures highly accurate and consistent detection at the 10 nm level.

    Key Advantages

    • Proactive monitoring: Semiconductor manufacturers can take real-time action before product quality is affected, with reliable 10 nm detection.
    • Silica-calibrated: The system is calibrated using silica size standards, ensuring accurate representation of UPW contamination.
    • Consistency across multiple locations: Repeatable 10 nm measurements ensure uniformity and process control.
    • No false counts: The system eliminates uncertainties caused by refractive index variations or microbubble interference.
    • Cleanroom-ready: Designed specifically for cleanroom environments, the Nano LPM CPC uses UPW as the working fluid, minimizing contamination risks.
    • Field verification: Onboard injection ports allow users to easily verify instrument sensitivity and response rate in the field.

    The Nano LPM™ System is your solution for reliable, real-time UPW nanoparticle monitoring, ensuring optimal process control and semiconductor production quality.

  • Turbo II™ Vaporizers
    MSP, a Division of TSI®, offers a completely new line of Vaporizers for liquid source vaporization in gas-phase processing such as CVD and ALD used in semiconductor device fabrication and industrial coating applications....

  • Next Generation of Vapor Delivery Solutions for CVD and ALD

    Better Vaporization, Higher Throughput, Less Waste

    The MSP Turbo II™ Vaporizers offer enhanced throughput by delivering higher vapor concentrations, enabling faster deposition and etch rates. When paired with the MSP Turbo™ Liquid Flow Controller (LFC), this system provides fast response times, reducing both liquid waste and wafer processing durations.

    Compact Design: Through advanced fluid dynamic and thermodynamic research, MSP has doubled vapor output while reducing the size of the heat exchanger by 50%. This breakthrough demonstrates Moore's law in vaporization technology.

    Highly Stable Output: Turbo II™ Vaporizers deliver highly stable vapor concentrations, making them ideal for sensitive processes like PECVD. Their consistent vapor delivery ensures reliable, long-term field performance.

    Extended Lifetime: Built to last the lifetime of the system, the MSP Turbo II™ Vaporizers are designed as durable components rather than consumables, contributing to overall tool longevity.

    Lower Cost of Ownership: With their long lifespan, increased throughput, and reduced liquid waste, Turbo II™ Vaporizers lower the total cost of ownership. They also require less maintenance compared to other vaporizer solutions, leading to further cost savings.

    Flexible for Diverse Liquids: These vaporizers accommodate a wide range of liquids, including difficult precursors with low vapor pressure or those with narrow thermal decomposition windows, ensuring flexibility in various applications.

    Advanced Vaporization Technology: Using droplet vaporization and direct liquid injection (DLI), Turbo II™ Vaporizers provide stable, uniform vapor essential for high-quality thin films and improved wafer yields in thin film applications.

  • PRE Challenge Wafers and Photomasks
    Ensure high yields and minimize surprises in semiconductor manufacturing with MSP’s affordable PRE Challenge Wafers and Photomasks for Particle Removal Efficiency (PRE) testing. Verify cleaning system efficiency with reliable, consistent results....

  • PRE Challenge Wafers and Photomasks for Particle Removal Efficiency (PRE) Testing

    Maintaining high yields and minimizing production surprises in semiconductor manufacturing requires verifying the efficiency of your cleaning systems. MSP, a Division of TSI®, offers an affordable and reliable solution with our PRE Challenge Wafers and Photomasks for Particle Removal Efficiency (PRE) testing.

    Uniform and Consistent Depositions

    Our PRE Challenge Wafers and Photomasks are dry-deposited with NanoSilica™ or PSL particles, or specific process particles, ensuring precise size distribution, composition, and particle count. This uniform deposition enables consistent and accurate testing of your cleaning systems, providing reliable data for performance assessment.

    Why Validate Your Cleaning Process?

    Inefficient cleaning can lead to defects, which negatively impact productivity, yield, and profitability in semiconductor manufacturing. By using our standards, cleaning issues are identified early, allowing for timely adjustments before significant losses occur.

    Choose the Right Particle Suspension

    We offer a choice between NanoSilica™, PSL particles, and Process Particles™ to meet your specific testing needs:

    • NanoSilica™ and PSL: Ideal for evaluating spatial dependence with uniform particle suspensions.
    • Process Particles™: Simulate real-world contaminants, offering a more accurate PRE assessment.

    All particle suspensions are NIST-traceable, ensuring reliability, auditability, and controlled cleanroom environments without introducing contaminated particles.

    Key Applications

    • R&D: Develop new cleaning systems and processes.
    • Manufacturing: Validate cleaning systems before shipment (FAT) and during installation/qualification (SAT).
    • Operations & Service: Revalidate systems throughout their lifespan or after maintenance to ensure consistent performance.

    Features and Benefits

    • Dry deposition reduces aging effects compared to wet methods.
    • Accurate and repeatable standards across wafers, batches, and lines.
    • Wide selection of substrate recipes and particle types.
    • NIST-traceable particle suspensions ensure reliable results.
    • Cost-effective process control, delivered triple-wrapped and ready for shipment.

    MSP's PRE Challenge Wafers and Photomasks are a cost-effective, reliable solution for improving semiconductor cleaning systems and maximizing production yields.

  • Wafer Contamination Standards
    Wafer contamination standards consist of particles deposited on a wafer (sizes from 100 mm to 450 mm) with the industry's best particle size and count control. These certified standards for wafer inspection tools are totally customized for each customer....

  • Characterize and optimize the sensitivity and overall performance of your wafer inspection/metrology system with Dev-Dep™ Development Wafer Contamination Standards from MSP, a Division of TSI. These high-quality wafer contamination standards are made to your specifications with quick turnaround, enabling short learning cycles during tool and process development.

    Particles smaller than 1.6 µm (1600 nm) are deposited with advanced particle generation and DMA technology of MSP's Particle Deposition Systems designed for best-in-class deposition of micro-particles and nanoparticles. The modal diameter of deposited nanoparticles is controlled with nanometer-level accuracy and sub-nanometer resolution. Particles larger than 1.6 µm, up to 20 µm, are deposited with newly-developed large-particle generation technology.

    Every substrate is handled with extreme care and packaged with MSP's signature triple-wrap packaging, preventing contamination during transport.

    Deposit Patterns

    Particles can be deposited in Spot and Full (Blanket) patterns with standard processing. Arc and Ring patterns are available with non-standard processing.

    Wafer Types

    Wafers of all types and many sizes can be readily processed with all of MSP's particle deposition tools. These wafer types include:

    • Silicon (Si)
    • Glass
    • Sapphire
    • SiC (silicon carbide)
    • GaAs (gallium arsenide)
    • Film
    • Patterned

    MSP stocks 200 mm and 300 mm bare silicon (Si) wafers, and can provide glass wafers and sapphire wafers according to customer specifications. Customers can also provide wafers of their choice (bare, film, patterned) for deposition. Wafers as small as 100 mm and as large as 450 mm can be processed.

    Particle Materials/Types

    Particle size standards available for deposition include PSL (polystyrene latex) spheres and SiO2 spheres (NanoSilica™ Size Standards are best-in-class SiO2 size standards offered only by MSP). MSP Process Particles™ Suspensions are material standards currently offered in 14 materials for deposition.

    • MSP NanoSilica™ Size Standards: Concentrated suspensions of amorphous SiO2 particles with highly uniform size distributions, suspended in ultra-pure water (UPW). Silica is the material of choice for calibrating high-sensitivity inspection systems with intense DUV light sources because they are stable under exposure to DUV radiation, and with a lower refractive index than PSL, they are more representative of real-world particles.
    • MSP Process Particles™ Suspensions: Broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW); representative of real-world contaminant particles encountered in semiconductor device fabrication processing.