Altechna R&D

Vilnius, 
Lithuania
https://www.wophotonics.com/

• 小間番号7201

Femtosecond laser micromachining solutions provider.

WOP | Workshop of Photonics is a femtosecond laser micromachining solutions provider for industry and science customers around the globe.

Owning 20 years of experience, we ensure an innovative approach to laser technology with exceptional expertise in glass, empowering electronics with breakthrough glass processing through selective laser etching (SLE).

Our innovative solutions are based on the patent family of 13 in-house and 2 licensed patents.

Ultrashort pulse laser capabilities allow us to work with a wide range of materials and offer ultra-high precision solutions for industries such as Semiconductors, Optical Communications, Medical, Automotive, and Scientific.

We deliver fully integrated services from proof of concept, prototyping to micromachining services and tailor-made laser workstations as well as technology transfer and licensing agreements.

WOP technological solutions for Semiconductor Industry:

• TGV | Through Glass Vias by SLE - WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process.
• Fiber Arrays - our solution enables reaching excellent precision results: Tight tolerances within ±0.25 μm; Straight, flared, or with a cone for easier fiber insertion; High density, standard 0,25 mm pitch; Ultrafast direct laser writing, suitable for high-scale production.
• Glass Dicing - WOP’s patented technology for cutting glass & sapphire offers ultra-high precision and quality for tempered and non-tempered glass and sapphire: cut width less than 1 μm; Low chipping <20 μm; No post-processing required.
• ABF Glass Dicing - Selective removal of ABF film; Combined ABF and glass dicing; Zero-kerf glass dicing with low kerf ABF film removal (>200 µm, thickness dependable); Low chipping <10 μm;

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   出展製品

  
  TGV | Through Glass Vias by SLE
  WOP offers high surface quality TGV glass wafers densely packed through holes that require none or minimum post-processing before being used in your production process. Best-in-market vias quality!... More Info Less Info
  
  
  
  
  Our produced Through Glass Via (TGV) wafers are suitable for the metallization of microholes.
  We produce TGV microholes wafers of custom size and design, eligible for any metalization process you use. Rapid prototyping and production services for your individual designs.
  Features:
  • Glass Thickness: <1.1 mm
  • Wafer sizes: all standard up to 200 mm
  • Minimum microhole diameter: 10 µm
  • 99% identical diameter holes
  • Positional accuracy: +-3 µm
  • No chipping
  • Super smooth sidewalls: RA < 0,08 µm
  • Hole type: Through Via (True circle or Ellipse), Blind Via (True circle or Ellipse)
  • Hole shape: hourglass
  • Option: singulation from hole-processed large-sized glass
  

  FemtoGLASS: Glass cutting and dicing workstation

  The FemtoGLASS is a new glass & sapphire laser cutting and dicing workstation ideal for research & development, and volume manufacturing.... More Info Less Info
  

  

  
  

  The FemtoGLASS is based on patented WOP glass & sapphire cutting technology, which is unique for ultra-high quality and precision results.

  Understanding market needs and the growing demand for glass as a material, we have developed a unique state-of-the-art glass and sapphire cutting & dicing technology to overcome today’s market challenges.

  Our technology outperforms other glass-cutting methods and thus is very well applicable in semiconductors, microfluidics, and micro-optics industries.

  Features:

  • Ultra-thin (30 µm to 2 mm in a single pass) glass & sapphire cutting
  • High process speed – up to 800 mm/s
  • All shapes: circular, square, irregular
  • Tunable dicing process for different substrate thicknesses
  • Inner and outer contours
  • Easy breaking for non-tempered glass and self-breaking for tempered glass

  FemtoGLASS applications

  FemtoGLASS main applications are glass wafer dicing, custom thin glass cutting, mobile phone screens, buttons, camera lens cutting, smart glasses screens cutting, micro-optics, etc.

  It offers ultra-high quality and precision on tempered glass, non-tempered glass & sapphire, small feature sizes, and high aspect ratios unachievable with alternative technologies.

  Quality of cut:

  • Cut width less than 1 μm
  • Low chipping <10 μm
  • No post-processing required

  FemtoGLASS video: https://www.youtube.com/watch?v=fQ9gLd3ZGfE