Zhejiang Hangke Instrument

Hangzhou,  Zhejiang Province 
China
https://www.hkyq.com.cn/
  • 小間番号3836

Zhejiang Hangke Instrument Co., Ltd. is a high-end equipment manufacturing company with a long history and rich technological heritage, headquartered in Hangzhou, China. The company focuses on semiconductor reliability (burn-in) test and special power supply fields, and is a professional testing solution provider, efficient testing system service provider, and leading electronic power equipment developer. Since its inception, the company has always adhered to client needs, insist independent research and development, and after decades of innovation accumulation, it now has burn-in screening equipment and testing systems covering the entire series of electronic components. It has also undertaken many national key engineering supporting tasks and has been repeatedly awarded for excellent quality. 
The company currently has over 300 employees, with more than 50% being professional technical personnel, 68 patents in reserve,it has been awarded "provincial science and technology progress" multiple times for our ability of research and development. Its mature sales system and excellent after-sales team can quickly respond to client needs, and its products and services have reached all over the country, receiving long-term recognition from numerous clients.


 出展製品

  • IGBT power cycle test system
    The system is suitable for power cycling test of various sizes of lGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component....

  • The system is suitable for power cycling test of various sizes of lGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component. During the change, through transient temperature response curve of the tested chip and data processing of the test waveform to obtain the full thermal characteristics of the electronic component.
    * Supports minute/second power cvcling test

    * Equipped with oil-cooled platform, which can auickly and automatically calibrate the K-factor of the component.

    * Fixture supports adiustable strenath and depth for effective clamping of different packaging of modules.

    * With solenoid water valve, can automatically adjust the cooling water flow according to the actual situation, or manually adjust.

    * Through the transient temperature response curve of the test component, data processing of the test waveform to obtainthe comprehensive thermal characteristics of the electronic component.

    * Full experimenter human safety considerations are set.

  • Large scale integrated circuit burn-in test system
    The system supports dual temperature zones, and can carry out HTOL burn-in test at room temperature +10°C~150°C, and detect the out-put signal of the device in real time during the burn-in process, in which the vectors are automatically compared....

  • * Each burn-in board provides 8 programmable power supplies (0.5~10V/0~25A), and the power supply specifications can be customized individually
    * Each burn-in board is available with 184 DR channels and 32 bidirectional I/O channels
    * Each chamber can support up to 4 kw of heat dissipation
    * Vector files in STIL, VCT, VEC formats can be directly imported and used
    * Chip BIST test is allowed
    * Fully compatible with DL601H machined burn-in boards, plug and play
    * Full experimenter human safety considerations are set
  • Wafer-level reliability test system
    The system is suitable for electrical reliability test for controllable high-temperature for 6/8-inch wafer-level devices based on JEDEC reliability test standard;...

  •  It provides high-precision and high-voltage output, and saves records high-precision current, controllable temperature and other parameters, and according to the recorded test data, export experiment tables and MAP diagrams in multiple formats.

    * Customized high-temperature adjustment semi-automatic probe station, supporting ≤5 wafers simultaneous burn-in test
    * Support the independent protection function of each wafer die, and control the over-current and over-voltage beyond the limit
    * Support nitrogen protection to prevent wafer oxidation, and support overvoltage protection when filling
    * Support to change the Burn-in Board or probe card to different package devices for test
    * Support wafer mounting contact spot detection, realtime temperature and pressure detection
    * Support HTGB, HTRB and other burn-in test functions, Vth/IDS/IGS and other parameters of automatic testing and data analysis
    * Support built-in wafer layout MAP configuration, realtime display of data and query of historical data
    * Support access to the centralized control station (smart core protection cloud) system, customized docking with the MES system
  • DHTRB
    The system performs dynamic high temperature reverse bias burn-in test for SiC MOS transistor with reference to AQG324 test method....

  • Up to 12 stations can be tested in each test area, with independent pulse source configurations. RT+10°C~200°C test temperature is available for the device. It has the function of short-circuit disengagement test of test device, which can automatically detach the faulty device from the burn-in test without affecting the normal test of other devices.

    * dv/dt>50V/ns (Coss<300pF)
    * 2us overcurrent protection
    * It can be heated independently at room temperature +10°C~200°C, and is compatible with static HTRB test
  • DHTGB
    The system performs dynamic high temperature gate bias burn-in test capabilities for the third-generation SiC MOS transistor, and each test area can independently burn up to 12 work stations....

  • Independently 12 configurable pulses, and the leakage current of the test gate does not interfere with each other. The device is available at room temperature +10°C ~ 200°C. It has the function of short-circuit disengagement test of test device, which can automatically detach the faulty device from the burn-in test without affecting the normal test of other devices.

    * High-speed dv/dt>1V/ns
    * nA leakage current test
    * Threshold value voltage test
    * Customized burn-in test boards are available for different device packaging, power requirements, etc
    * Full experimenter human safety considerations are set