It provides high-precision and high-voltage output, and saves records high-precision current, controllable temperature and other parameters, and according to the recorded test data, export experiment tables and MAP diagrams in multiple formats.
* Customized high-temperature adjustment semi-automatic probe station, supporting ≤5 wafers simultaneous burn-in test
* Support the independent protection function of each wafer die, and control the over-current and over-voltage beyond the limit
* Support nitrogen protection to prevent wafer oxidation, and support overvoltage protection when filling
* Support to change the Burn-in Board or probe card to different package devices for test
* Support wafer mounting contact spot detection, realtime temperature and pressure detection
* Support HTGB, HTRB and other burn-in test functions, Vth/IDS/IGS and other parameters of automatic testing and data analysis
* Support built-in wafer layout MAP configuration, realtime display of data and query of historical data
* Support access to the centralized control station (smart core protection cloud) system, customized docking with the MES system