ALD ( Atomic Layer Deposition) is a thin film deposition technique used to create ultra-thin films with precise control over thickness and composition. It operates through a cyclic process that involves alternating exposure to two or more gaseous precursors, which react on a substrate surface to form a thin layer.
ALD is widely used in semiconductor manufacturing, photovoltaics, and various nanotechnology applications. Its ability to create high-quality films makes it essential for advanced materials development.