Fraunhofer IZM’s “All Silicon System Integration Center Dresden” (ASSID), established in 2010, is an integral part of Fraunhofer IZM, specializing in 3D wafer-level system integration and packaging. ASSID operates a state-of-the-art 300mm process line based on Cu-Through Silicon Via (TSV) technology, offering tailored development and manufacturing of complex 3D systems. The process line includes individual modules for TSV formation, post-processing, assembly, and 3D stacking, enabling both application-oriented development and the qualification and prototype production of 3D wafer-level system-in-packages. Typical application areas include high-performance and quantum computing, as well as edge sensor systems, driving advancements in these fields with cutting-edge technologies and flexible industry collaboration.