Evatec

The system provides deposition solutions—including metals, piezoelectric films, and dielectric layers—for a wide range of applications such as advanced semiconductor packaging, front-end wafer processing, power devices, wireless, optical thin films, and optoelectronic integration.

Users can configure the system for either single-wafer or batch processing using combinations of Single Process Modules (SPMs) capable of PVD, ALD, PECVD, etching, and more, or by employing Batch Process Modules (BPMs).

The CLUSTERLINE®300E is a cluster-type thin-film deposition tool widely adopted both in Japan and internationally for 300mm wafer sputtering processes, including backside metallization (BSM), under bump metallization (UBM), and redistribution layers (RDL). In particular, it boasts the industry's leading track record and market share for backside metallization.

Beyond conventional sputtering, the platform offers high expandability, supporting integration with etching modules, PECVD modules, and PEALD modules, making it a highly versatile solution for next-generation semiconductor manufacturing.

As a deposition platform for advanced packaging on panels, this system offers not only sputtering modules but also chemical etching capabilities, providing exceptional flexibility. It delivers high quality and productivity, positioning it as one of the highest-performing sputtering systems in its class. The platform has established a No.1 market share in this segment.

By incorporating Evatec’s proprietary Atmospheric Batch Degasser (ABD) system, the tool enables excellent adhesion and ultra-low contact resistance. It plays a key role in addressing the growing demand for energy efficiency in advanced packaging applications, particularly in emerging AI devices.

By combining expertise from delivering over 5,000 high-speed optical disc systems and experience from more than 3,000 semiconductor PVD systems, Evatec offers ultra-high-speed thin film deposition capabilities.

The system supports a wide range of sputtering applications—including optical filters, reflective coatings, transparent electrodes, anti-scratch coatings, decorative coatings, and corrosion-resistant coatings—with the ability to integrate surface cleaning and etching processes.

It is also applicable to advanced coatings such as protective layers for metal separators in fuel cells, decorative coatings for automotive interior components, and anti-reflection/transparent electrode coatings for automotive displays.

Key Features:

• High-speed inline single-substrate architecture for rapid thin film deposition

• Increased throughput with robotic handling, eliminating manual operation

• High-productivity solutions for various deposition processes

In addition, Evatec provides comprehensive thin film solutions—including PVD, ALD, PECVD, and etching—for semiconductor wafers, advanced packaging, MEMS, and wireless filter applications, supporting deposition of metals, piezoelectric materials, and dielectric films.

The LLS EVO II is a versatile vertical batch sputtering system with a dynamic design concept. It supports up to five different target materials and features a separated Load Chamber (LC) and Process Chamber (PC) configuration for enhanced process integrity.

It accommodates a wide range of substrate sizes and shapes up to 200 × 230 mm, and offers configurable power supply options to increase process flexibility.

Substrate degassing and etching in the load chamber ensures high-purity processing conditions in the process chamber. The system allows for easy conversion between different substrate sizes in under five minutes, making it ideal for flexible manufacturing.

Key Features (Partial List):

• Up to five sputter sources, supporting DC, DC pulse, RF, and RF/DC power configurations

• Simultaneous sputtering from up to three cathodes

• Reactive sputtering with oxygen and nitrogen

• High vacuum system with turbo pump, cryo pump, and water trap options

HEXAGON is a high-volume wafer-level packaging platform designed for applications such as Fan-Out Wafer-Level Packaging (FOWLP), offering degassing, etching, and metal deposition at atmospheric pressure with exceptionally low cost of ownership.

The system enables high-speed wafer processing through synchronized indexer-based wafer transport. During 24/7 production, full-face etching and deposition are made possible by accurate and repeatable wafer positioning, supported by in-chamber wafer sensing technology that ensures precise handling.

Key Features:

• Capable of processing wafers passivated with organic films that release large volumes of gas

• Atmospheric front-end module equipped with a high-performance dual end-effector robot, achieving short wafer exchange times

• Synchronized indexer enables high-throughput wafer transport

• Extended uptime with reduced maintenance, featuring etch shield kit lifetime exceeding 20,000 wafers