Frontier Semiconductor

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Over 1000+ metrology tools sold worldwide:

Dimensional Metrology
Thickness and relevant dimensional applications. Nano scale profiler to monitor all surface for wafer and advanced packaging process. ... More Info Less Info



FSM 413AA Series: Fully Automated / Manual Multi-Probe System
Applications:
•Wafer substrate Thickness,
•Total Thickness Variation(TTV)
•Through-Silicon Via(TSV)
•Roughness
•Warpage
•Thin-film Thickness
•Trim/Trench width and depth
•Laser grooving,
•Bump height/size
•Step height/size


Film Stress Metrology

Monitoring all thin film process from room temperature to 900°C Patented Opti Lever ... More Info Less Info





FSM 128 Series

Room temperature wafer film stress measurement on patterned wafer, able to generate local stress variation mapping.

FSM 500 Series  

Wafer film stress measurement from room temperature up to 500℃

FSM 900 Series

Wafer film stress measurement and material characterization from room temperature up to 900℃ in vacuum chamber to avoid oxidation, (enable process integration simulation)

•FSM902TC-VAC

Fast cooling metrology to increase wafer process throughput

•FSM903TCR-VAC

Rotary wafer station for generating wafer stress maps to support process simulation.



Material Characterization

Unique Offline Instruments for All Thin Films Film Chemical Analysis Film Adhesion Analysis ... More Info Less Info





FSM 900TC-VAC

•Stress

•Thermal Desorption Spectroscopy(TDS) to identify stress issues via film outgassing

•Reflectivity

•Film thickness

•Study of Coefficient of Thermal Expansion (CTE) after stress measurement

•4 Point Probe for sheet resistance,

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FSM 902TC-VAC

Quick cooling metrology to increase wafer process throughput

FSM 903TCR-VAC

Rotary wafer station for generating wafer stress maps to support process simulation.