OPERA D, DUEETO
-Maximized Throughput with Multi-stacked Die Prober
The multi-stacked architecture enables simultaneous testing of multiple dies in a single setup, maximizing throughput and efficiency.
The Multi Parallel Test function shortens overall test time and enhances performance.
-High-heat Thermal Control
Active Thermal Control ensures stable and precise temperature regulation even under extreme heat conditions.
Rapid thermal response and uniform heat distribution maintain consistent test quality and reliability.
-High Pin Force Stability
The 3-POD Tilting Chuck System provides exceptional rigidity and stability even in high-force probing environments.
It precisely compensates for edge deflection, minimizing pin force variation and maintaining consistent contact pressure during long testing cycles.
This results in reliable, repeatable measurements and superior test consistency.
-Superior Warpage Handling
Delivers stable alignment and contact performance even under severe package warpage conditions.
Advanced compensation and control mechanisms enhance test precision and overall reliability.