Diamond Lapping pad belongs to the category of consolidated abrasive grinding technology. Based on a specially designed pad structure, it is made of diamond powder and resin, and can be used in the lapping and thinning process of hard and brittle materials such as glass substrates (microcrystalline, quartz, borosilicate, white board, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), piezoelectric terminals (lithium tantalate), and precision ceramics (aluminum oxide, aluminum nitride, silicon nitride).