NexGen Wafer Systems

PROCESS CHAMBERS  6

CHEMICALS  3 onboard

INTEGRATED METROLOGY  Thickness, Roughness, EPD

WAFER SIZES  6“, 8“, 12“

CARRIER INTERFACES  FOUP, SMIF, Open Carrier

THROUGHPUT  Up to 200 wafers per hour

FOOTPRINT  12 m2

PROCESS CHAMBERS  2

CHEMICALS  4 external

INTEGRATED METROLOGY  Thickness, Roughness, EPD

WAFER SIZES  4”, 6“, 8“, 12“

CARRIER INTERFACES  Open Carrier, SMIF, FOUP

THROUGHPUT  Up to 60 wafers per hour

FOOTPRINT  5m2 (PU) + 3m2 (CDS)

FOOTPRINT MG22-300  7m2 (PU) + 3m2 (CDS)

PROCESS CHAMBERS  1

CHEMICALS  4 external

INTEGRATED METROLOGY  Thickness, Roughness, EPD

WAFER SIZES  4”, 6“, 8“

CARRIER INTERFACES  Open Carrier, SMIF

THROUGHPUT  Up to 30 wafers per hour