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Fraunhofer Institute for Electronic Nano Systems ENAS

Chemnitz, 
Germany
http://www.enas.fraunhofer.de/en.html
  • 小間番号W1077


Next level of process and technology development

The Fraunhofer Institute for Electronic Nano Systems ENAS is the expert and development partner in the field of smart systems and their integration for various applications.

As a reliable innovation partner, we develop high performance sensors, new sensor and actuator systems based on integrated nano structures and standard technologies, beyond CMOS components, innovative integration technologies and extended reliability approaches. Moreover, we complement these topics by innovative developments in the fields of simulation, data analyses by means of artificial intelligence and security of systems. Through requirement engineering, we adapt the systems for different applications and embed them in higher-level, more complex systems.

Whether start-up, SME or large enterprise, we support customer projects along the whole value-added chain of smart systems starting from the idea, via design and technology development or realization based on established technologies up to tested prototypes as well as technology transfer.

 出展製品

  • Advanced testing from wafer to system
    Learn more about Characterization, Test and Reliability within the APECS Pilot Line and the contribution of Fraunhofer ENAS with the European Test and Reliability Center...

    • European Test and Reliability Center
    - Innovation needs Trust –

    The European Test and Reliability Center (ETRC) at Fraunhofer ENAS is a unique competence center in Europe for testing the quality and reliability of complex semiconductor components. With its state-of-the-art testing infrastructure, in-depth expertise, and strong network of partners from science and industry, the ETRC provides comprehensive solutions for assessing the quality, functionality, and durability of next-generation semiconductor functionalities.

  • Advanced Packaging and Heterogeneous Integration
    Learn more about the Chiplet Integration Platform within the APECS Pilot Line and the contribution of Fraunhofer ENAS on Advanced Packaging....

    • Learn more about the Chiplet Integration Platform within the APECS Pilot Line and the contribution of Fraunhofer ENAS on Advanced Packaging.

    We present our portfolio of Waferbonding Technologies, Chipbonding Technologies as well as 3D Integration. Meet our experts at our booth.

  • Nano and 3D patterning
    Learn more about a micro lenses array manufactured by nanostructure technologies at Fraunhofer ENAS....

    • Learn more about a micro lenses array manufactured by nanostructure technologies at Fraunhofer ENAS and the ZfM - Center of Micro and Nanotechnologies at TU Chemnitz. With our nanostructure technology (e-beam lithography, nanoimprint lithography, reactive etching), we produce sub-wavelength structures on 200 mm wafers for vertical optical transmission.
  • Environmentally friendly & sustainable processing
    Learn more about Greener Plasma Processing and a Nanotechnology Polymer platform for sustainable microelectronics....

    • Learn more about Greener Plasma Processing by using Halogen-free plasma-etching processes of silicon developed in the project HaloFreeEtch and by using closed-loop plasma control for lower emissions.

    The Individual Nanotechnology Polymer platform for the large-scale production of future semiconductor generations is a contribution to smaller, faster, more reliable, cheaper, and sustainable microelectronics.

  • Next Level Nanofabrication
    Learn more about next level nanofabrication by taking into account Simulation, Technology, Metrology and AI....

    • Learn more about next level nanofabrication by taking into account Simulation, Technology, Metrology and AI. Our experts optimized CMP processes in an holistic treatment.

Categories

700 製造サービス
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    • 701 製造サービス、またはコンサルテング
  • 製造工程サポートと開発
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  • パッケージ材料/相互接続/サブ部品/二次アセンブリデザインサービス
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    • 802 教育、研究機関
  • 教育訓練/研究機関（営利）/職業訓練
  • 教育訓練/研究機関（非営利）/学会/大学
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