Compact desktop design, yet ideal for testing all aspects of CMP for substrates up from tips to 6-inch diameter wafers.
It complies to all types of acidic and alkaline slurries.
Furthermore, CM-015 is designed by downsizing from stand-alone models intended for 8“ or 12” wafers. Consequently, unlike typical desktop machines, it features high mechanical rigidity. It offers excellent data compatibility when transferring polishing data acquired by this machine to the standalone machines.
Furthermore, pneumatic load adjustment enables more stable planarity compared to conventional weight-load types. Another advantage is that this pneumatic load type machine allows easy transition from polishing load to rinsing low load, while weight-load types require removing weights to switch to low load during post-polishing rinsing.
You would use DCM-015 for CMP of semiconductor manufacturing of course, R&D of CMP process, and R&D of CMP materials.
Kitagawa Gress Tech provides services including CMP process development, prototyping, contract processing, and the design, manufacture, and sale of semiconductor experimental and manufacturing machines (grinding, CMP polishing, cleaning).
We propose, design, and manufacture custom equipment tailored to customer needs for “planarization,” “smoothing,” and “thin-film processing,” as well as for processes used in cutting-edge technologies such as semiconductor devices, SiC power devices, SOI, micro-machines (MEMS), optical devices, LED sapphire substrates, and OLEDs.