ニデックアドバンステクノロジー

PCB業界での豊富な実績を活かし、プロセス側の視点に立った設計/製作を行います。当社グループ会社とタイアップし、ウェハからパネル、ガラスまで様々なプロセスで採用実績のある搬送技術を駆使したハンドリングが可能となり、End Effectorはお客様のニーズに合わせて全て自社設計にて対応します。

Leveraging our extensive experience in the PCB industry, we design and manufacture from the perspective of the process. In collaboration with our group company, Nidek Instruments, we are able to handle everything from wafers to panels and glass using transport technology that has been adopted in a variety of processes, and we design all End Effectors in-house to meet our customers' needs.

NATS-1304

量産対応の高速・高信頼性 KGD（Known Good Die）検査システム。
高スループットと低Ls設計により、業界トップクラスとなる300ns以下の保護時間を実現しました。
検査項目は DC / AC / UIS など、用途に合わせて柔軟に選択可能。

A high-speed, high-reliability KGD (Known Good Die) test system
designed for mass production.
Combining high throughput with ultra-low Ls, it achieves an industry-leading protection time of under 300 ns.
Flexible test coverage including DC, AC, and UIS - select exactly what your application requires.

NATS-2120

業界初、導通検査・LCR検査・DC検査を１台に統合。
検査要求に応じて当社オリジナルの専用治具を切り替えるだけで、多種多様な製品に柔軟に対応できます。
複数の検査ニーズには、お客様と一緒に最適な仕様づくりもサポートいたします。

The world’s first system integrating continuity, LCR, and DC testing in a single platform.
By simply switching our original custom fixtures, the system adapts flexibly to a wide variety of products.
For more complex testing needs, we work with customers to develop the optimal specifications together.

Cmos Image Sensor対応2D-MEMS PC

2D-MEMS技術をCIS向けプローブカードに適用し、狭ピッチ・狭パッド対応、電気特性向上、短納期対応を実現しました。

2D-MEMS technology to CIS PC; Ideal for testing products with narrow pad widths, Improved electrical characteristics, and Quick delivery.

高電圧対応加圧構造プローブカード

放電対策をプローブカードに適用；マルチDUTに対応、垂直型・カンチレバーの双方に対応

Applying of anti-erectrical discharge technology to Probe Card; Multi-DUT available, Adaptation for vertical / cantilever cards

Large Tray対応 3D／AFVI＋AI検査システムは、大型基板や高密度バンプに最適化され、AI＋CVアルゴリズムと欠陥ライブラリにより高精度な分類・解析を実現します。独自の多次元光源とS-Visionにより多様な光学情報を同時取得し、JEDEC／Largeトレーに対応します。

The Large Tray-Ready 3D/AFVI + AI Inspection System is designed for large substrates and high-density bump applications. Combining advanced AI with traditional computer-vision techniques and a rich defect library, it delivers accurate defect classification and robust analysis for complex substrates. Powered by Nidec’s full-spectrum, multi-dimensional lighting and S-Vision imaging architecture, the system captures multiple full-color images with different optical effects in a single scan, improving imaging efficiency by 2–3×. It supports both JEDEC and large trays, aligning with the industry trend toward larger formats and highly automated handling. With high precision, high resolution, and advanced analytical functions such as TTV/STV metrology, the system provides a comprehensive solution for next-generation panel inspection, enhancing quality control and production yield.