GMM(Gallant Micro. Machining CO., LTD.) has long been dedicated to the field of precision equipment, providing high-accuracy processing systems essential for advanced semiconductor packaging. Our service network spans Taiwan, Singapore, Malaysia, Japan, Korea, the United States, and other regions.
For SEMICON Japan, we are pleased to showcase two of our core advanced-packaging solutions:
the Die Sorter and the High-Precision Die Bonder.
Die Sorter — High Precision & High Stability for Advanced Packaging
GMM’s Sorter is designed specifically for advanced packaging and multi-die architectures. It features:
- High-precision Pick & Place positioning, ideal for small-die and high-density packaging requirements
- High-speed and stable die sorting and inspection processes that enhance yield and overall production efficiency
- Compatibility with various die sizes, materials, and process conditions, providing exceptional flexibility for diverse customer needs
High-Precision Die Bonder — A Key Enabler for Advanced Packaging
Our showcased Bonder leverages GMM’s long-standing expertise in precision motion platforms, offering:
- High-accuracy bonding and repeatable alignment performance for advanced packaging structures such as multi-layer stacking and die integration
- Excellent bonding consistency and quality, reducing process variation
- A flexible platform design that allows customized fixtures, workflows, and bonding strategies tailored to customers’ specific process requirements
We sincerely invite you to visit the GMM booth to explore the latest advancements of our Sorter and Bonder systems, and to discuss future developments together.