EV Group Korea

Gyeonggi-do, 
Korea (South)
http://www.EVGroup.com
  • Booth: 1440


Welcome to visit us at Booth # 1440 for EVGroup.

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.


 Products

  • EVG®580 ComBond®
    High-Vacuum Wafer Bonding System enabling electrically conductive and oxide-free covalent bonds at room temperature ...

  • The EVG®580 ComBond® covalent bonding system for engineered substrate and power device production integrates advanced surface preparation processing steps to ensure contamination- and oxide-free bonds at room temperature. Combining materials with different properties to produce electronic devices, such as III-V compound semiconductor materials like gallium nitride (AaN), gallium arsinde (GaAs) and indium phosphite (InP) with silicon substrates, can lead to enhanced device performance and open up new capabilities.  

    Built on a modular platform to support high-volume manufacturing (HVM) requirements, the EVG®ComBond system can bond nearly anything on anything to enable new applications including:

    • Multi-junction solar cells
    • Silicon photonics
    • High-vacuum MEMS packaging
    • Power devices
    • Compound semiconductor and other advanced engineered substrates for “beyond CMOS” applications such as high-mobility transistors, high-performance/low-power logic and radio frequency (RF) devices.
  • EVG®150XT
    Automated Photoresist Resist System for logic and memory advanced packaging applications ...

  • The EVG®150 XT combines EVG’s expertise in lithography with the newly developed XT platform to enable the industry’s first high-volume-manufacturing resist processing system for mid-end and back-end interconnect applications, including through-silicon via (TSV) formation, wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D-IC packaging. The advanced system is designed for processing resists, spin-on dielectrics and thick films. The EVG®150XT features nine process modules that can operate simultaneously for multi-parallel wafer processing.

    Features

    • Supporting wafer sizes up to 300 mm
    • Coating of thick- and thin-film resists from below 1 µm to over 100 µm
    • Available options include spin coat, spray coat, NanoSpray™, develop, bake/chill/vapor prime and Inline metrology modules
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)
    • User-friendly, flexible software
  • GEMINI®FB XT
    Automated Production Fusion Wafer Bonding System combining several performance breakthroughs to surpass ITRS requirements for wafer bonding ...

  • The GEMINI®FB XT, EVG’s next-generation fusion wafer bonding platform, clears several key hurdles to the industry’s adoption of 3D-IC/TSV technology in high-volume manufacturing. A three-fold improvement in wafer-to-wafer bond alignment accuracy, combined with a 50 percent increase in throughput over the previous industry benchmark platform, supports IC manufacturers’ efforts to move wafer stacking upstream in the manufacturing value chain from mid-end-of-line (MEOL) and back-end-of-line (BEOL) processing to front-end-of-line (FEOL) processing.

    Features

    • Incorporates EVG’s newly introduced SmartView® NT2 bond aligner, which enables wafer-to-wafer alignment accuracy below 200 nm (3σ)
    • Accomodates up to six pre-processing modules such as Clean Modules, LowTemp™ Plasma Activation Modules, Alignment Verification Module and Debond Module
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module) and optional FSS (Foup Storage System)
  • EVG®850TB/DB (XT Frame)
    Automated Temporary Wafer Bonding / Debonding Systems. Next-generation thin wafer processing for high-volume 3D IC manufacturing, Based on EVG’s new XT Frame equipment platform ...

  • Built on the company’s XT Frame platform, the new EVG®850TB/DB systems double the throughput over EVG’s previous-generation, industry-benchmark equipment platform to up to 40 stacks per hour. The systems enable the highest productivity, repeatability and yields in thin-wafer processing. Designed for EVG’s open materials platform approach, the EVG®850TB/DB support a wide range of adhesives from various materials suppliers, providing customers with the most flexible choice of temporary bonding materials.

     

    Features:

     

    • Highly efficient continuous mode operation (zero idle time)
    • Ultra-fast handling system
    • Up to nine process modules
    • Up to 4 FOUP load ports
    • Up to 10 additional FOUPS in a Local Foup Storage System
    • In-line metrology module option enables real-time monitoring of bonding/debonding process
    • Qualified for a wide range of bonding and debonding processes, including low temperature debonding methods like ZoneBOND®

     

    ZoneBOND® is a registered trademark of Brewer Science Inc.

  • IQ Aligner®
    Automated Mask Alignment System optimized for contactless proximity processing at highest throughput. ...

  • The IQ Aligner Automated Mask Alignment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment. The high automation level makes the IQ Aligner Automated Mask Alignment System suitable for volume production applications while tremendously lowering equipment operation and maintenance costs.

    Features

    • Manual or fully automated, high-throughput operation
    • Full-field exposure, large gap and dark field mask alignment for wafer bumping, chip scale packaging and similar demands
    • NanoAlign® featuring high resolution top and bottom side split field microscopes
    • Handling of multiple wafer sizes up to 300 mm with quick change-over time
    • Windows® based user interface
    • Darkfield mask alignment
    • Options include automated mask handling and bond alignment capability
  • EVG®560
    Automated Wafer Bonding System Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding. ...

  • The EVG560 Automated Wafer Bonding System accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EV Group's manual bonding systems with enhanced process control and automation, the EVG560 bonding system delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

    Features

    • Fully-automated processing with automated loading and unloading of bond chucks
    • Up to four bond chambers for various bonding processes
    • Automatic loading and unloading of bond chambers and cooling station
    • Remote modem diagnostics