*Ideal system for removing photoresist layers (also SU-8) after dry processes like RIE or Ion Beam etching as well as after high dose implant processes.
*Silicon wafers or other substrate cleaning prior wet processing to achieve a better wettability for an uniform and efficient result.
*Applicable for processes in MEMS and nano technology.
*Polymer removal e.g. after Bosch processes.
*Removal of organic sacrificial layers.
*Conditioning of bioactive compounds.