Micronox® MX2302 is an engineered semi aqueous solvent cleaning solution designed to clean all low and high solid paste fluxes common in die attach, flip chip, copper pillar and emerging semiconductor assembly.
- Effective in Ultrasonic, Centrifugal and Semi-Aqueous Spray Under Immersion Cleaning Systems
- Compatible with All Soldering Materials and Metal Layers
- Excellent Performance on 2.5D & 3D Chip Stacking
- Rinses Easily & Complete to Increase Wire Bond Yields