Plan Optik AG

  • Booth: 4338

Glass, Quartz and Fused Silica Wafers from Plan Optik AG

Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations.

Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers. Based on Plan Optik's expert knowledge the wafers are developed in collaboration with customers such as OSRAM, Infineon, Motorola, Samsung, Honeywell and Bosch.



 Press Releases

  • Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers has expanded its production range on carriers for the handling of small semiconductor wafers as well as small substrates for various applications.

    Your new process tool does not fit to all existing products?
    You have invested in new, larger equipment but your customers still need smaller wafers to be processed?
    The substrates you need to process do not fit to standard wafer diameters since they are rectangular or do have any different shape than round wafer shape?

    Semiconductor wafers undergo a wide range of process steps. Most tools could handle standard wafer diameters only. In order to keep the possibility of processing smaller or differently shaped wafers or other substrates, one of Plan Optik's wafer and substrate handling carriers could fulfill your assignment easily.

    Such process carriers by Plan Optik consist of either surface processed silicon wafers (pockets which hold smaller dimensions) or a combination of a blank silicon wafer with a bonded glass carrier on top. Boundless possibilities are available. These process carriers are available in many combinations (300 mm to 200 mm, 200 mm to 150 mm, etc.). Even multiple small substrates could be handled (eg four 3" wafers on one 200 mm carrier or hundreds of smaller sizes such as 10 mm x 10 mm substrates).

    Plan Optik's process carriers are fitting to many semiconductor or MEMS related processes. High temperature and chemical resistance, incredible low tolerances, thermal expansion adjusted to silicon or other substrate materials are available. Special non sticking or sticking surface properties could be implemented. A perfect surface quality created by Plan Optik's well established double side polishing and unique laser marking including QR codes for easy process tracing make them suitable for a huge number of re-use cycles.

    In order to guarantee the highest quality, Plan Optik employs quality management systems certified to ISO TS 16949, ISO 14001 and ISO 9001.

  • Plan Optik AG, the leading manufacturer of glass, quartz and glass-Si compound wafers has added laser patterning to its structuring techniques recently. Glass, quartz (eg fused silica) and silicon can be patterned generating an extremely high accuracy.

    Laser patterning is used for small feature sizes down to 20 microns. Patterning of different layer depths typically requires different process runs. Between each run, alignment to the previous layer is mandatory. In laser patterning, different layers will be processed in one run. No alignement will be necessary which increases layer to layer accuracy dramatically.

    Compared to other common patterning techniques such as wet-chemical etching or sand blasting, laser patterning enables much higher aspect ratios and leads to a much better accuracy and very smooth patterned edges.

    Even pre-cutting or dicing into small dies can be materialized.

    Laser patterning works directly from your layout file which could be .dxf, .gds or .dwg. Other file types could typically also be used after converting them. This enables a very fast and cheap prototyping since no masks are needed.

    Plan Optik AG implemented laser patterning in addition to it's already existing bulk micro machining methods. Together with wet etching, ultra sonic drilling, diamond tool drilling and sand blasting Plan Optik is now using all relevant glass and quartz surface micro machining methods in house. This makes Plan Optik the one stop shop for all patterned glass and quartz parts for MEMS and semiconductor applications.

    In order to guarantee the highest quality, Plan Optik employs quality management systems certified to ISO TS 16949, ISO 14001 and ISO 9001.

    Please click here to get your personal quotation on laser patterned wafers which fit to your needs perfectly.

  • Plan Optik AG, the leading manufacturer of glass wafers, has expanded its production on glass and silicon carriers for Thin Wafer Handling of semiconductor wafers.

    Semiconductor wafers undergo a wide range of process steps. TSV wafers for 3D wafer level packaging require very thin semiconductor substrates. Due to progressing thickness reduction of the wafers, handling in standard semiconductor processes requires carrier substrates supporting them.

    Various Thin Wafer Handling sytems are already established in the semiconductor market. Plan Optik offers carriers for all types of Thin Wafer Handling such as from 3M, T-Mat, Brewer Science, EVG, Suss, TOK and others.

    Plan Optik AG is focusing on the production of high end carriers from glass and silicon which meet these requirements excellently. High temperature and chemical resistance, incredibly low tolerances (down to 1 micron thickness variation), thermal expansion adjusted to the used semiconductor material are just a few examples for this. Different carrier types such as for silicon and gallium arsenite wafer handling are available.

    A perfect surface quality created by Plan Optik's well established double side polishing and unique laser marking including QR codes for easy backtracing make them suitable for a huge number of re-use cycles – up to 20 times! Glass carriers could be strengthened to make them virtually unbreakable. Alkaline free glass is available as well.

    Blank carriers for fast laser release, perforated carriers for chemical release and carriers with recessed pockets are available for various support systems such as laser debonding, chemical and thermal debonding.

    Standard glass carriers are offered for 2” to 300 mm wafer handling. Most common types are available from stock – clean room packed and ready for use.

    In order to guarantee the highest quality, Plan Optik employs quality management systems certified to ISO TS 16949, ISO 14001 and ISO 9001.


    Cap wafers for wafer level packaging up to 300 mm available in various materials and combinations. Applications in consumer electronics, automotive, aerospace, chemistry, pharmaceuticals and semiconductors.silicon vias) ...

  • Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.

    Packaging wafers by Plan Optik are used to pack and thus to seal hermetically optical or chemical sensors, pressure sensors and acceleration sensors. Typical industrial applications lie in the fields of consumer electronics (CMOS imaging, micro-mirrors), automotive technology (pressure sensors, e.g. tires, engine monitoring), aerospace (3D acceleration sensors), chemistry (micro-reaction technology), pharmaceuticals (lab-on-chip) and in the general manufacture of semiconductors.

    Quartz and fused silica materials • RF applications • Minimal surface roughness • Diameters 50 - 300 mm • Thickness from 200 µm ...

  • Plan Optik manufactures quartz wafers (SiO2) both as single-item production and in large-scale series using both synthetic "fused silica" and "fused quartz" extracted from natural raw materials. In contrast to crystalline quartz, the substance used here is amorphous quartz glass. The diameter is between 50 - 200 mm with low thickness tolerances, high quality surfaces and low ttv values.

    Plan Optik's quartz wafers are defined as an alkaline-free and ultra-pure substrate, virtually unadulterated by foreign matter. They are therefore used in semiconductor technology and as a coating substrate. Typical industrial fields of application include the construction of RF modules as well as micro fluidics and medicine. Plan Optik's quartz wafers are resistant to high temperatures and virtually non-fluorescent.

    Process carriers for the manufacture of ultra-thin substrates of silicon, gallium arsenide and other special materials ...

  • Plan Optik produces carrier wafers as a carrier substrate for the processing of thin semiconductor wafers. These carriers are used to permit the safe handling of delicate semiconductor wafers (e.g. those made of silicon and gallium arsenide). Semiconductor wafers are becoming ever thinner, and at the same time the requirements as regards their thickness tolerance and surface quality for back thinning, sawing and numerous other processes continue to rise. For this reason high-precision carrier wafers (carriers) are a fundamental requirement when it comes to processing. Plan Optik manufactures these carriers using a special glass which provides the perfect substrate material in this respect, because it demonstrates excellent thermal and chemical stability. An additional advantage is the possibility of re-using such carriers - thus making an important contribution not only to the reduction of costs but also to environmental protection.