SPTS Technologies Ltd.

Newport, 
United Kingdom
http://www.spts.com
  • Booth: 6202


SPTS Technologies invites you to our visit our booth, 6202.

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing and UV Laser Drilling for through mold vias.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit www.spts.com and www.orbotech.com.


 Press Releases

  • Orbotech announces SPTS Technologies Receives a $16M Multiple System Order from WIN Semiconductors Corp.

    YAVNE, ISRAEL, July 30, 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received an order, worth approximately US$16M, for multiple etch and deposition systems from WIN Semiconductors Corp. (WIN), the world’s leading provider of pure play GaAs foundry services for the wireless infrastructure and networking markets. The systems will be used to make Heterojunction Bipolar Transistors (HBT) and Pseudomorphic High Electron Mobility Transistors (pHEMT) devices in WIN’s Fab C, their 3rd and newest fab. The systems will ship in the second half of 2015.

    “We are proud to have been a supplier to WIN since their inception in 1999,” said Kevin Crofton, president of SPTS and corporate vice president at Orbotech. “They recently announced their 1 millionth GaAs wafer shipment, and our systems have added value to every one of those wafers. Over those 16 years, our technology roadmaps have been shaped by leaders such as WIN, and this repeat order confirms that our etch and deposition solutions continue to deliver production advantages to our customers”

    Steve Chen, Senior Vice President of WIN commented, “The GaAs device market is entering a phase of growth, driven by the increasing complexity of RF designs inside smartphones and the accompanying infrastructure. We are successful because we have the flexibility and technology bandwidth to react to the fast changing demands of a consumer driven market, and SPTS has the same mindset. Sixteen years ago, we selected SPTS to join us in the new world of GaAs foundry services, and today we own approximately 60% of the foundry market share and are opening our 3rd fab. The support and commitment of SPTS has contributed to that success. I look forward to entering the next phase of growth with them.”

    Virtually all power amplifiers in a modern smartphone are made from circuits built on GaAs semiconductors, and enable handsets to transmit voice and data back to the base station tower. Power amplifiers (PAs) are one of the most critical RF components and the leading smartphones contain up to 5 PAs. The increasing complexity in dealing with multiple RF bands from 2G up to 4G, and the uptake of more capable smartphones, are expected to support the market’s continued growth.

    About WIN Semiconductors Corp.

    WIN Semiconductors is the leading global provider of pure-play GaAs and GaN wafer foundry services for the wireless, infrastructure and networking markets. WIN Semiconductors provides its foundry partners with a diverse portfolio of Hetero-junction Bipolar Transistor and Pseudomorphic High Electron Mobility Transistor technology solutions that support leading edge products for applications from 50 MHz to 100 GHz. Custom products built by WIN Semiconductors Corp. are found in a vast array of markets, including smartphone, mobile infrastructure, optical communications, CATV and automotive applications.

    For more than 15 years, WIN has provided foundry services from its state of the art, ISO9001/14001 certified 150mm GaAs facility headquartered in Tao Yuan City, Taiwan. This multi-site manufacturing facility has more than 1600 employees and provides WIN customers with a diverse array of device technology platforms and value added services, including DC/RF product testing, Cu wafer bumping and turn-key package solutions for accelerated product development.

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control. Many factors could cause the actual results to differ materially from those projected including, without limitation, timing and extent of achieving the anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively integrate and operate SPTS's business, the timing, terms and success of any strategic or other transaction, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and each of its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices, the timing for a verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea, the final outcome and impact of this matter, including its impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

    COMPANY CONTACTS:

    WIN Semiconductor Corp: Shareholders/Investors/Media ir@winfoundry.com T: +886-3-3975999

    SPTS: Destanie Clarke, Corporate Marketing Director, T:+44 7951 203278. destanie.clarke@orbotech.com

    Orbotech: Anat Earon-Heilborn, Director of Investor Relations, Orbotech Ltd, T: +972 8 8942 3582
    Ann Michael, Senior Corporate Marketing Communications Manager, Orbotech Ltd, T: +972 8 8942 3148

     

  • Imec and SPTS Technologies, an Orbotech Company, Collaborate on Critical Processes for 3D IC Wafer Stacking

    SAN FRANCISCO – July 14, 2015 – Nano-electronics research center imec and SPTS Technologies, an Orbotech company (NASDAQ: ORBK) and supplier of advanced wafer processing solutions for the global semiconductor and related industries, announced today at SEMICON West that they are jointly developing a highly accurate, short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding.

    Wafer backside processing is critical for 3D-IC wafer stacking. Today, through-silicon vias (TSV) formed using ‘via-middle’ processing, are typically exposed from the backside of 300mm device wafers by a combination of mechanical grinding and wet or dry etch processes. Dielectric layers are then deposited by plasma enhanced chemical vapour deposition (PECVD) to passivate and mechanically support the exposed TSVs prior to bump/RDL (redistribution) formation, followed by chip-to-wafer or wafer-to-wafer bonding.

    To develop an industrially viable 3D-IC technology, the via reveal process requires a shorter cycle-time etching process. Additionally, due to accumulating non-uniformities coming from the TSV frontside etching, bonding and grinding processes, variations of a few microns may occur in residual silicon thickness above the via tips. Therefore, a highly selective process to thin TSV liners and smooth post-etch surfaces is essential to achieve the necessary precision and control within wafer uniformity.

    Imec and SPTS are developing a dry etching solution that features in-situ end-point detection. This enables controlled and very precise processing. The process achieves the required TSV height while avoiding lengthy and multiple rework steps thus minimizing the overall cost per wafer. Our first results demonstrate that 1.57µm nail height can be controlled within 300nm range (see image below).

    To follow the via reveal etch step, imec and SPTS will also work on PECVD dielectric passivation stacks, with SiO and SiN layers deposited at temperatures below 200°C. Films will be engineered to optimise device electrical performance and stress-managed to minimize warpage of the thin die after debonding,

    The collaboration will use SPTS’s Versalis fxP system, a single-wafer cluster platform carrying both etch and dielectric deposition modules to be installed into imec’s 300mm packaging line in Q32015.

    “Equipment suppliers are key in developing an integrated solution for the challenges of scaling technology into advanced nodes,” said An Steegen, senior vice president process technology at imec. “The collaboration with SPTS confirms imec’s direction to accelerate innovation for all our partners by closely interacting with suppliers at an early stage of development.”

    “Imec plays a critical role in the long term development of the entire semiconductor value chain, from front to back-end,” said Kevin Crofton President of SPTS, and Corporate Vice President at Orbotech. “Their pre-competitive work supports the roadmaps of their core customers. Their remit dictates that they work with vendors and processes that are enabling for imec and their partners, and to be selected is a huge endorsement of our capabilities. We look forward to the results and milestones that we will achieve together.”

    Imec’s research into 3D-IC includes key partners such as GLOBALFOUNDRIES, INTEL, Micron, Panasonic, Samsung, SK Hynix, Sony, and TSMC.

       

    Caption: Top SEM view for wet and SPTS’s dry etch via reveal process

    —end—

    This press release can be downloaded at http://www2.imec.be/be_en/press/imec-news/imec-orbotech-dry-si-removal.html

    About imec

    Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in the Netherlands, Taiwan, USA, China, India and Japan. Its staff of about 2,200 people includes almost 700 industrial residents and guest researchers. In 2014, imec's revenue (P&L) totaled 363 million euro. Further information on imec can be found at www.imec.be. Stay up to date about what’s happening at imec with the monthly imec magazine, available for tablets and smartphones (as an app for iOS and Android), or via the website www.imec.be/imecmagazine

    Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.)and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).

    About Orbotech

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.

    About SPTS Technologies

    SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports etch, PVD, CVD and thermal wafer processing solutions for the MEMS, advanced packaging, LEDs, high speed RF on GaAs, and power management device markets. With manufacturing facilities in Newport, Wales, Allentown, Pennsylvania, and San Jose, California, the company operates across 19 countries in Europe, North America and Asia-Pacific. www.spts.com

    Contacts:

    imec : Hanne Degans, Press officer and communications specialist, T: +32 16 28 17 69, Mobile : +32 486 06 51 75, Hanne.Degans@imec.be

    SPTS: Destanie Clarke, Corporate Marketing Director, T:+44 7951 203278. destanie.clarke@orbotech.com

    Orbotech: Anat Hearon-Heilborn, Director of Investor Relations, Orbotech Ltd, T: +972 8 8942 3582

    Ann Michael, Senior Corporate Marketing Communications Manager, Orbotech Ltd, T: +972 8 8942 3148

     

     

  • SPTS Extends its Lead as the Supplier of Choice for the Fastest Growing Format with Multiple Sigma fxP PVD Systems Orders

    YAVNE, ISRAEL, December 9, 2015 | ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has received orders totaling approximately $57 million in value for multiple Sigma fxP PVD systems from a global manufacturer of packaged die.  The systems will deposit under bump metals and redistribution layers (RDL) for Fan-Out Wafer Level Packaging (FOWLP) production.  System deliveries and revenue recognition are expected to commence in the fourth quarter of 2015 and continue throughout the first half of 2016.  Orbotech’s fourth quarter and full year 2015 revenue guidance included the initial revenues expected to be recognized from these orders during this period.

    According to a report entitled “Fan-Out WLP Forecast: Update 09/2015” published by research firm Yole Développement in September 2015, the launch of TSMC’s InFO format is expected to increase industry packaging revenues for FOWLP from $240M in 2015 to $2.4B in 2020.  With a projected 54% CAGR, Yole expects FOWLP to be the fastest growing advanced packaging technology in the semiconductor industry.  The burgeoning market for thinner smart phones, tablets, wearable devices and Internet of Things (IoT) connected consumer goods has created a significant need for this cost-effective high density format.   There are numerous FOWLP platforms in or near production from many companies including eWLB (STATS ChipPAC, NANIUM and ASE), SLIM & SWIFT (Amkor), InFO (TSMC) and RCP (Freescale). As part of Orbotech, with its multiple touch points throughout diverse electronics manufacturing environments, SPTS plays a key role in FOWLP advanced packaging solutions with numerous customer installations.

    “This groundbreaking multi-PVD system order, the first from any semiconductor manufacturing company for FOWLP, is a ‎milestone moment for advanced packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “It marks the beginning of an industry-wide transition of FOWLP from a niche packaging technique for small devices such as RFID and power management ICs to mainstream architecture for high value chips.  We expect FOWLP to become the leading low cost, high density packaging format.”

    This order reinforces advanced packaging as SPTS’ most important growth driver.  During 2015, the company has received multiple new technology orders from packaging fabs for a range of applications including plasma dicing for frame-supported wafers, through-silicon via etch and deposition for 3DWLP and TSV reveal and passivation as announced by imec on July 14, 2015.

    About Sigma fxP PVD

    The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices.  In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP.  For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound.  Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.  For more information please see http://www.spts.com/tech-insights/advanced-packaging/fowlp.

    About Orbotech Ltd.

    Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries.  The company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components.  Virtually every electronic device in the world is produced using Orbotech systems.  For more information, visit http://www.orbotech.com/.

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995.  These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties.  The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements.  These forward-looking statements are made based on management's expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech's operations and business environment, all of which are difficult to predict and many of which are beyond the Company's control.  Many factors could cause the actual results to differ materially from those projected including, without limitation, timing and extent of achieving the anticipated benefits of the acquisition of SPTS; Orbotech's ability to effectively integrate and operate SPTS's business, the timing, terms and success of any strategic or other transaction, cyclicality in the industries in which the Company operates, the Company's production capacity, timing and occurrence of product acceptance (the Company defines 'bookings' and 'backlog' as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and each of its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices, the timing for a verdict in the ongoing appeal of the criminal matter and ongoing investigation in Korea, the final outcome and impact of this matter, including its impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company's customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and other risks detailed in the Company's SEC reports, including the Company's Annual Report on Form 20-F for the year ended December 31, 2014, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

     

    COMPANY CONTACTS:

     

    Anat Earon-Heilborn

    Tally Kaplan Porat

    Director of Investor Relations           

    Head of Corporate Marketing

    Orbotech Ltd.                                   

    Orbotech Ltd.

    Tel: +972-8-942-3582 

    Investor.relations@orbotech.com                   

    Tel: +972.8.942.3603

    Tally-Ka@orbotech.com


 Products

  • Delta® Deposition Systems
    SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging ...

  • PECVD

    • Wafer sizes from 75mm to 300mm
    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
    • Up to 10 gas lines and optional on-board liquid delivery system
    • Mixed frequency plasma capability for stress tuning
    • Active platen cooling for critical, low temperature [<175°C] packaging applications
    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

    Markets Served

    MEMS applications demand a wide range of dielectric film types,SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers

    Advanced 3D-IC applications, SPTS offers low temperature [<175°C] processes compatible with 300mm bonded substrates. Applications include via-last TSV liner and via-reveal passivation.

    SPTS is the only PECVD provider who can deposit electrically robust, stable nitride and oxide films at <200°C

    RF-IC semiconductor applications, SPTS develops processes and hardware for today’s production needs and Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

    Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers

  • Omega® Etch Systems
    SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors ...

  • Plasma Etch

    ICP Etch
    The Omega® ICP process module uses a patented high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the market leader for compound semiconductor applications.

    Dielectric Etch
    SPTS’s Omega® SynapseTM process module is an ICP-based high density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.

    The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10.

    Si DRIE
    Install base of over 1000 DRIE process modules, SPTS’s market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

  • Sigma® Deposition Systems
    The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD ...

  • Sigma Metal Deposition Technologies

    Standard PVD – conventional sputter modules for low topography features

    Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

    C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

    Advantages

    Single wafer processing, improves yields and on-wafer performance, when compared to batch processing.

    Planar target with full face erosion,avoids re-sputtering, reduces particle contamination and improves target life

    Rapid target change (<5mins), with common magnetron increases uptime

    Reliable handling of fragile, thinned or bowed wafers

    "Super Uniformity" option available for specialist applications

    Multi-wafer degas to increase throughput for long (low temp) degas applications

    Common software for 200mm and 300mm systems - ease of use

    Markets Served

    MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC