SUSS MicroTec SE

HwaSeong City, Gyeonggi-Do, 
Korea (South)
http://www.suss.com
  • Booth: 5622

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com


 Press Releases

  • Tokyo, November 28th, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces a strategic reseller partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo. Under the terms of the agreement, Kanematsu becomes the exclusive distributor for the entire SUSS product portfolio in Japan.

    Effective January 1st, 2017, Kanematsu PWS LTD. will be responsible for all SUSS MicroTec related Sales and Service activities, supported by the experienced SUSS Japan Business Development & Technical Sales Support team on site.

    This new partnership will clearly stand by SUSS MicroTec's responsibility to their customers, and will enable further expansion of their activities in Japan.

    "Our main objective is the satisfaction of our customers by the means of outstanding products and reliable service. SUSS MicroTec believes that the partnership with Kanematsu will strongly contribute to meet those requirements - A win-win situation for both companies, ultimately to the benefit of our customers in Japan." says Rolf Wolf, Senior Vice President Global Sales & Service.

    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com



    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Senior Manager Investor Relations
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    franka.schielke@suss.com
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com
  • Garching, September 6, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, today announced the launch of its new generation of the fully automated ACS300 platform. The modular system of the ACS300 Gen3 is specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip and 3D packaging.

    The tool addresses the needs of a highly competitive and cost-sensitive market. Efficient module stacking allows for the smallest footprint for a system with eight coaters and developers on the market, saving costly cleanroom space. The three-level modular system delivers high yield and throughput by fast and precise robots, intelligent scheduling algorithms and a highly advanced monitoring system. The ACS300 Gen3 provides for simultaneous 200 mm and 300 mm wafer processing without the need for a mechanical changeover. In addition, the tool can be equipped to handle 330 mm and warped wafers with a warpage of up to 10mm. The ability to process multiple wafer shapes and sizes as well as various coat and develop materials makes the platform an efficient all-in-one solution. State-of-the-art chemical-saving features address economic as well as ecological concerns, working in line with even the most rigid sustainability standards.

    "The ACS300 Gen3 is our new flagship for the advanced packaging market. Having worked in close collaboration with our customers, we have created a platform that really excels. We are very excited to present some new groundbreaking functions. The ACS300 Gen3 stands for high process stability, repeatability and yield. For example, it has more sensors for logging and control than any coating system SUSS MicroTec has ever produced", says Gary Choquette, General Manager of the Coater/Developer product line. "With this brand new generation of the ACS300, we supply our customers with a high-quality, state-of-the-art tool at a very favorable cost of ownership."

    About SUSS MicroTec
    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com


    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Senior Manager Investor Relations
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    franka.schielke@suss.com
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com
  • Garching, June 30, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of the MA/BA Gen4 series today. The new generation of SUSS MicroTec's semi-automated Mask and Bond Aligners extends its capabilities by major improvements in alignment accuracy, ergonomic design and further reduced cost of ownership. With the launch of the fourth generation, SUSS MicroTec introduces a new platform system. The two platform types are configured differently and consist of the MA/BA Gen4 for standard processes and the MA/BA Gen4 Pro series for advanced high-end processes. By moving to this new platform concept, SUSS MicroTec further optimizes the Mask Aligner product portfolio to better align with customer requirements.

    Main application of SUSS MicroTec's MA/BA Gen4 series is full-field lithography in Academia, MEMS, 3D Integration and the Compound Semiconductor market. It furthermore handles processes like bond alignment, fusion bonding and SMILE imprint. In addition to standard wafer processing the MA/BA Gen4 series reliably processes delicate substrates, such as fragile, warped or uneven surfaced wafers.

    "Our new manual Mask Aligner series sets a high benchmark regarding cost efficiency, user friendliness and leading edge process results" said Dr. Per-Ove Hansson, CEO SUSS MicroTec. "With this new platform concept, we further align with different customer requirements - the MA/BA Gen4 for standard lithography processes or the leading edge MA/BA Gen4 Pro for small-series production and more demanding solutions, e.g. our Soft Conformal Imprint Lithography (SCIL) solution."

    About SUSS MicroTec
    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com


    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com
  • Garching, May 19, 2016 - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the LI Series - a new Surface Laser Imaging platform as pre-announced on May 4, 2016.

    The highly versatile technology of the LI for laser surface processing ranges from sub micrometric pattering of resist coated substrates to micro-ablation, photo-chemistry treatment as well as metrology.

    The patterns, defined by a CAD process, are transferred by accurately moving the targeted substrates underneath a focused and scanning laser beam. In addition, the Laser Imager configuration is highly customizable, to best fit the specific requirements of each user. The technology supports substrate sizes from small pieces up to 300 mm, and it reaches a resolution down to 0.8 µm. Multi-layer alignment is possible via both top and bottom side alignment optical systems. Beside the 405 nm GaN laser for standard thin resist lithography processes, a second laser source can also be added to additionally address diverse processes such as, among other, thick resists like SU8, and infrared sensitive materials.

    Core advantage of the Laser Imager is its flexibility, making it suitable for the various requirements of academic and industrial R&D facilities. The main applications include a wide variety of nano- and 3D structuring for high resolution wafer lithography, micro-optical components, sensors, microfluidic devices, and photo mask manufacturing.

    "With the Surface Laser Imaging platform, we add a tool to our product portfolio that expands our existing exposure equipment set towards higher resolution requirements for leading edge applications." says Dr. Per-Ove Hansson, CEO of SUSS MicroTec AG. "With this addition, we are enhancing our leadership position and offering the most comprehensive set of products and technologies for the lithography R&D market."

    About SUSS MicroTec
    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit
    http://www.suss.com


    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com
  • Garching, April 26, 2016 - SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, today announced the launch of a new UV-LED lamp house for use in its first exposure tools, which have a leading position in the market for more than fifty years. SUSS MicroTec strives to bring sustainability and economic thinking in line with ecological aspects. With the development and implementation of the environmentally low impact UV-LED lamp house concept for Mask Aligner, SUSS MicroTec has taken a further important step in terms of resource conservation and environmental protection.

    The new UV-LED light source has a much longer life than conventional mercury vapor lamps. Moreover, it no longer needs warm-up and cool-down - the LED light source is only switched on during the actual exposure process. Both factors contribute to low energy consumption. In terms of health, safety and environmental protection, the LED technology provides a significantly improved solution. Finally, the use of LED lighting in lithography provides for maximum flexibility in process design. It is therefore an ideal addition to the SUSS Mask Aligner MO Exposure Optics which ensures optimal exposure results.

    "The new LED lamp house features the latest in technology and thus meets the growing demand for environmental sustainability and energy efficiency.", says Dr. Per-Ove Hansson, CEO of SUSS MicroTec. "By combining leading edge innovations with our environmental strategy we not only create cost benefits for our customers but also protect the environment."

    About SUSS MicroTec
    SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com


    Contact:
    SUSS MicroTec AG
    Franka Schielke
    Schleissheimer Strasse 90
    85748 Garching, Deutschland
    Tel.: +49 (0)89 32007-161
    Fax: +49 (0)89 32007-451
    Email: franka.schielke@suss.com

 Products

  • MA200 Platform
    Alignment and Exposure for a Multitude of Applications

    Especially designed for high volume production the MA200 mask aligner platform is suited for automated processing of square substrates and wafers up to 200 mm. ...

  • Highlights

    + Leading process stability
    Unmatched throughput for thick materials
    Process flexibility for a multitude of applications
    + Angular exposure system for the exposure of steep to perpendicular sidewalls

    It combines leading-edge 1x lithography technology with a variety of innovative features making it the system of choice for thick resist MEMS applications, 3D patterning over topography and advanced packaging applications such as 3D packaging, fan-out, bumping as well as compound semiconductor and image sensors. 

    The MA200 platform offers intelligent solutions for a large range of process requirements. Its various alignment options, flexible optics and special add-ons make it an all-purpose tool for multiple handling and processing needs.

    A high level of automation, e.g. with an optional automatic filter exchange unit, shortens valuable process times and significantly reduces cost of ownership. For an integrated lithography solution the MA200 platform allows clustering with a coat/bake/develop module.

    Ease of use has played a major role in the design of the MA200 platform. Features such as an adjustable monitor and an ergonomic I/O interface, a continuous-run loadport and direct view on the exposure stage make it comfortable to work with the MA200 platform even under high work load.

    With its wide range of add-ons the MA200 platform is easily adaptable for specific applications. The optional angular exposure system is designed for processing vertical sidewalls in thick resists. Special wafer handling toolings allow for the treatment of sensitive substrates.

    Check further options of the MA200 platform for special processing needs.

  • ACS300 Gen3
    Powerful Solution for Advanced Packaging Applications

    The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides coating, developing and baking functionalities.
    ...

  • Highlights

    + Small footprint
    Efficient chemical handling
    Flexible process configuration
    High throughput capabilities
    Stable process results

    Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.


    One tool for all advanced packaging applications

    By offering multiple process technologies such as photo resist, polyimide and PBO coating within one system, the ACS300 Gen3 delivers high efficiency. It also provides capabilities for up to five resist or four develop chemistries per module for optimal process flexibility. Moreover, the universal hotplate design eliminates the need for specific hotplates for different resist or PI types. The ACS300 Gen3 allows for simultaneous 200 and 300 mm wafer processing without mechanical changeover.

    Attractive cost of ownership
    The ACS300 Gen3 allows for efficient module stacking, thus saving costly space in the cleanroom. Up to twelve modules can be conveniently arranged on top of one another in a three-level modular system while the tool’s multiple chemical-saving features achieve further savings. Whether SUSS MicroTec’s proprietary GYRSET technology, a novel dispense technique or a chemical recirculation system - the tool uses chemicals economically and works in line with even the most rigid sustainability standards.

    Excelling at throughput
    When using the optional second robot system the ACS300 Gen3 reaches throughput rates up to 240 wph in a three-step process. An advanced process control system optimizes processing time: scheduling algorithms can be selectively swapped to ensure that time slots of bottleneck steps are fully utilized. Furthermore, features such as developer chemicals at elevated temperatures and flow modes reduce process times.

    Consistent process monitoring leading to high yield
    What makes the ACS300 Gen3 stand out is its high degree of process control. It is possible to continuously log process data for all relevant parameters such as temperature, flow, pressure, volume, purge rates, etc.. Data logging allows for precisely tuned process parameters, repeatable results and quick identification of potential weak points. Processes become more stable and repeatable, and yield can be significantly increased.

    For more information please klick here

  • DSC300 Gen2
    Projection Scanner DSC300 Gen2

    The projection scanner DSC300 Gen 2 suitable for wafer sizes up to 300mm utilizes latest technologies of projection lithography.
    ...

  • Highlights

    + Broadband 1:1 projection lens (Wynn Dyson)
    Selectable numerical aperture (NA) of 0.07 to 0.14
    Resolution 3µm
    Alignment precision <1µm


    The system is designed to meet the requirements for wafer-level packaging, 3D packaging and bumping application and is ideal for emerging packaging applications such as CU pillar bumping and wafer-level chip-scale packaging. With its optical performance, alignment accuracy and high level of automation the system represents the latest projection scan technology. The scanning technique results in excellent image uniformity across the wafer (+/- 3%).

    With the projection scanner DSC300 Gen2 SUSS MicroTec offers a complementary technology to its mask aligner portfolio and lowest cost of ownership alternative for traditional projection stepper lithography.

    For more information please click here

  • ELD300
    ELD300 Debonder
    The ELD300 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. The ELD300 module is designed to debond glass carriers from full thickness wafers or thinned 200/300mm tape-frame mounted wafers. ...

  • Highlights

    + Short debond cycle times
    No thermal stress on devices
    High level of automation
    Compatible with wide range of common glass carrier systems

    It is based on the application of an Excimer laser which uses nanosecond, high energy 308nm laser pulses to break the chemical bonds in a release layer or the actual adhesive which holds the glass carrier to the device wafer. This Excimer laser based debonding process does not produce significant thermal stress and therefore ensures the integrity of sensitive components. The ELD300 module is designed to debond glass carriers from full thickness wafers or thinned 200mm and 300mm wafers which are mounted on tape frames.

    Using the ELD300 enables high throughput debonding for applications in 2.5D and 3D integration, 3D MEMS and CIS, as well as in the field of power devices to be carried out quickly and carefully.

    During the debonding process a 308nm wavelength Excimer laser is raster scanned across the wafer. The Excimer laser breaks the molecular bonds in the UV light-absorbing adhesive or release layer at the interface to the glass carrier without producing thermal stress. After debonding, the glass carrier can be removed with a vacuum handler. All relevant debonding parameters such as the scan pattern, laser fluence or step field overlap are recipe programmable.

    A fully automatic operation, including substrate handling and carrier removal is supported by integrating the ELD300 module into the XBC300 Gen2 debonder.

    The ELD300 offers a cost-effective alternative to the laser stepper ELP300 Gen2, which also supports laser-based debonding besides other material patterning and laser ablation applications.

    For more information please click here

  • XB8
    Universal High-Force Wafer Bonder

    The XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200 mm. All process parameters can be adapted flexibly according to the requirements. ...

  • Highlights

    + Flexibility in process development
    Process stability
    High yield

    In production, the high level of automation and the sophisticated design of the XB8 ensure a high level of process stability. This makes the XB8 wafer bonder ideal for applications from the MEMS, advanced packaging, 3D integration and LED fields.

    High Repeatability
    The XB8 wafer bonder has a closed process chamber with an automatic loading function. During loading, the chamber is flooded with nitrogen to ensure the best possible level of cleanliness. The high level of automation minimizes the influence the operator has on the process result. The thermal decoupling of the heater from the actual bonder chamber enables a process temperature which can be reproduced precisely, combined with a high repeat accuracy of the bonding force.

    Homogeneous Temperature and Bond Force
    The thermally decoupled ceramic heaters guarantee an even temperature distribution and also ensure an optimal bonding force homogeneity within the entire temperature range. An optionally available multi-zone heating system makes advanced control of the temperature distribution possible. The innovative structure of the XB8 wafer bonder enables optimal bonding force and temperature distribution across the wafer, resulting in high yield.

    In combination with the SUSS bond aligner suite the XB8 offers a highly precise bond alignment.

    The XB8 wafer bonder offers various tooling options.
    For more information please click here

  • XBS300
    Universal Temporary Wafer Bonder for High Volume Manufacturing

    The 200/300mm platform can be configured for low cost of ownership and maximum process flexibility. ...

  • Highlights

    + Compatible with Silicon or Glass Carriers
    Notch and Center Alignment for Same or Different Size Carriers
    Best in Class TTV with SUSS MicroTec Patented GYRSET®
    Built in Metrology for Non-Contact, Multi-Point Thickness Control
    Modular Design for Scalable Throughput and Minimized Footprint
    Open Platform Supporting Various Bonding Materials

    SUSS MicroTec‘s XBS300 platform for temporary bonding represents the next generation of high volume manufacturing temporary bonder solutions.   

    The XBS300 supports all key process steps for temporary bonding: release layer formation, adhesive coating, low force wafer bonding, UV curing or thermal curing and cooling. Thanks to its flexible configuration the XBS300 is able to process all commercially available temporary bonding adhesives(1).

    For more information please click here

    (1) The DuPont HD3007 Process is qualified on the XBC300 equipment platform