TECHNIC KOREA

Seoul, 
Korea (South)
http://www.technic.com
  • Booth: 2838


Hello, This is Technic Korea.

Technic supplies some of the most advanced chemistry solutions for semiconductor packaging applications in the industry.  Technic’s semiconductor advanced packaging electrodeposition chemistries, marketed under the name Elevate, are well respected for innovation and high quality and are used in many applications including RDL, pillars, microbumps and LED packaging.  Technic also supplies, photoresist strippers for liquid and dry film resist as well as metal etchants.

 

Technic Inc is a Rhode Island based, privately held corporation with over 900 employees worldwide.  For 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries.


 Products

  • Elevate Cu 6370
    High speed copper plating bath for a variety of semiconductor structures. ...

  • High speed copper plating bath able to achieve a plating rate of 3 - 4 microns per minute on a variety of semiconductor structures while maintaining good WIW and WID coplanarity. Ideally suited for standard pillars, micro pillars, RDL and other advanced packaging technologies.
  • Elevate Gold 7990
    Electrolytic non-cyanide gold process that produces pure, soft gold deposits. ...

  • Electrolytic non-cyanide gold process that produces pure, soft gold deposits. Offers several advantages over standard sulfite gold baths including neutral pH, no metallic grain refiners, longer bath life, exceptional throwing power and a very stableelectrolyte.

    FEATURES AND BENEFITS:
    1. High cathode efficiency.
    2. Low internal stress.
    3. Neutral pH for optimum compatibility with plating resist
    4. Deposit can be modified for different applications
    5. Cyanide free solution
    6. Compatible with standard industry plating tools


    DEPOSIT CHARACTERISTICS
    Deposit is semi-bright to bright
    Deposit purity: 99.99% gold (minimum)

  • TechniStrip® P1331
    An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layerreworking. Ideal for use in back end applications like TSV, Cu pillar, bumping, etc. ...

  • Technistrip® P1331 offers complete resin dissolution of thick film photoresist such as THB151N, THB121N, AZ125XT, etc. In addition Technistrip® P1331 is fully compatible with Dryfilm resist such as WB2000 series.


    Technistrip® P1331 utilizes a novel cleaning formulation that has been proven to provide a loading capacity three times higher than a standard TMAH based blend. Additional advantages of the Technistrip® P1331 are its very high material compatibility and safety compared to standard TMAH based blends. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.


    FEATURES AND BENEFITS
    1. Very high stripping rate, >10μm/min
    2. Complete resin dissolution
    3. Enhanced resin loading capacity
    4. Low evaporation rate, < 3 cc/hour/dm2
    5. High metal compatibility, <2A/min @60°C
    6. Complete water miscibility
    7. Suitable for batch (spray and immersion) and single wafer systems
    8. Low odor compared to standard DMSO/TMAH resist strippers
    9. Safety: Free of NMP and Hydroxylamine

  • TechniStrip® NF52
    A highly effective negative tone photoresist remover used mainly for advanced packaging applications. ...

  • Developed to address laminated photo-resins and liquid resins, the novel stripping formulation of the TMAH based TechniStrip® NF52 exhibits high dissolution performance compared to standard TMAH based blends.


    Additional advantages of the TechniStrip® NF52 are its very high material compatibility compared to standard TMAH based solutions. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.


    FEATURES AND BENEFITS
    1. Very high stripping rate, >10μm/min
    2. Great resin dissolution performance on dryfilm photoresist
    3. Bath life up to 72 hours @ 70 oC
    4. High metal compatibility, <2A/min @60°C
    5. Complete water miscibility
    6. Suitable for batch (spray and immersion) and single wafer systems
    7. Proven performance on DuPont, Ashai, TOK and other dryfilm photoresist.
    8. Safety: Free of NMP and hydroxylamine

  • TechniStrip® NI555
    Specially formulated to fully dissolve AZ EM advanced line of photoresist: AZ15nXt, AZ40XT and AZnLOF 2000 series. High metal compatibility from a DMSO and TMAH free solution. ...

  • TechniStrip NI555 is a stripper dedicated to novel generation of negative
    i-line resins, such as AZ15nXT.
    TechnicStrip NI555 was developed to address fast and complete resin film
    dissolution thus avoiding filter clogging and subsequent insoluble resin
    debris deposition encountered with most of standard stripping solutions
    Its tremendous cleaning performance and high dissolution kinetics make it
    suitable for applications ranging from batch, spray to single wafer tool
    platforms.


    TechniStrip NI555 is based on a non hazardous mixture of water soluble
    organic solvents and special dissolution activators that can be tuned to meet
    customer process specifications (Temperature, Process time, Metal
    compatibility, Surface roughness, etc…)