UB materials Inc.

Yongin-si, Gyeonggi-do, 
Korea (South)
  • Booth: 2376

Aim for the best-in-class company in slurry business for CMP

UB materials Inc., a Korean company, which is manufacturing CMP slurries for semiconductor use. We are manufacturing Tungsten CMP Slurry ,Poly-si stop and Nitride-stop slurry. And also developing other slurries for semiconductor and display panel use as well. We have the state-of-the-art technique for making slurry abrasive and slurry mixing system which was developed by Advanced Semiconductor materials and device research center, Hanyang University which has long time successful experience in CMP slurry business field. We are pursuing a Excellent CMP slurry maker on ward and will keep on trying to achieve our Goal.​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​


  • Tungsten(W) & Ceria CMP slurry
    1. Tungsten(W) CMP slurry
    - Dishing-free slurry for BG process
    - One-step slurry for Line-Hole process

    2. Nano colloidal ceria slurry
    - Less Scratch slurry
    - High polishing-rate selectivity between Si and SiO2 film ...

  • 1. 1-step tungsten(W) CMP slurry

    Slurry for tungsten(W) chemical mechanical planarization(CMP) process with 25nm crystal ZrO2 abrasives - Applications : Formation of tungsten plug, Tungsten plug, Tungsten line, Buried tungsten gate etc.


    2. Nano colloidal ceria slurry

    Slurry for poly-Si stop and nitride stop CMP process with CeO2 abrasives which is made by a wet synthesis reaction - Application : shallow trench isolation(STI) CMP process, poly-Si stop CMP process etc.


    - CeO2 abrasives; 20nm, 40nm, 60nm and 60nm embossing abrasive

    - Scratch free Poly-Si stop CMP slurry

    - Scratch free Nitride stop CMP slurry

    - Non-selectivity CMP slurry

      (Polishing rate selectivity among SiO2, Si3N4 and poly-Si = 1 : 1 : 1)