scia Systems GmbH

  • Booth: 2272

scia Systems - Solutions for thin film technology

The scia Systems GmbH manufactures advanced ion beam and plasma processing equipment, for the production of microelectronics, MEMS and precision optical components, in both, high volume production as well as applications in research and development. scia Systems provides highly reliable tools together with a superior technology support. The process systems address the entire spectrum in ion beam technology and are available with special source arrangements on platforms that accommodate all standard wafer sizes. The tools are flexible and modular in design. Several vacuum process chambers can be combined into cluster or in-line solutions, according to customer-specific requirements.

Technology Portfolio
-  Ion Beam Etching and Milling (IBE/IBM)
-  Ion Beam Trimming (IBT)

-  Physical Vapor Deposition (PVD)
-  Dual Ion Beam Deposition (DIBD)
-  Reactive Ion Etching (RIE)
-  Plasma Enhanced Chemical Vapor Deposition (PECVD)

-  Plasma Cleaning


  • scia Magna 200
    Cluster system for magnetron sputter deposition of up to 200 mm wafers. Typical applications include piezoelectric layers, optical coatings and passivation layers. ...

  • The scia Magna 200 uses a unique Double Ring Magnetron architecture (DRM 400 sputter source from Fraunhofer FEP). This enables a very high homogeneity of coatings at impressively high deposition rates. Due to its integrated control mechanisms, long term stability of processing is ensured.

    The system is available with either a single wafer load-lock or an automatic handling robot in a cluster configuration.


    • Temperature compensation films for SAW devices (e.g. SiO2)
    • Piezoelectric films with excellent crystalline orientation (e.g. AlN)
    • Optical coatings (Si3N4, SiO2, HfO2, Ta2O5, Al2O3)
    • Electrical insulating films (Si3N4, SiO2, Al2O3)
  • scia Mill 150
    System for large area Ion Beam Etching and Milling of single substrates up to 150 mm. Typical applications are the structuring of metal films for MEMS and sensors. ...

  • The scia Mill 150 is designed for large area Ion Beam Etching and Milling of single substrates. Typical users are in the field of research and development and low volume production.

    The scia Mill 150 can be used for Ion Beam Etching (IBE) with inert gases. Additionally the system can be applied for Reactive Ion Beam Etching (RIBE) as well as for Chemically Assisted Ion Beam Etching (CAIBE).


    • Structuring of MEMS and sensors
    • Structuring of MRAM
    • Structuring of metallic and dielectric multilayers
    • Ion Beam Smoothing
    • Microstructuring
    • Reactive etching of III/V Semiconductors
      (e.g. GaAs, GaN, InP)
  • scia Trim 200
    Ion beam trimming tool for localized film thickness trimming in MEMS applications. Typically used for frequency trimming in manufacturing of acousto-electrical devices and localized pole trimming of thin film heads and post-CMP processing. ...

  • The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. The correct trimming amount is achieved by varying the dwell time, while the focused ion beam scans across the wafer surface.

    The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.


    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Thickness trimming of Lithium Tantalate, Lithium Niobate or Quartz wafers
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Dimensional correction in manufacturing of MEMS components