Allwin21 Corporation

Morgan Hill,  CA 
United States
http://www.allwin21.com
  • Booth: 5138


Professionally USA supplier of semiconductor process equip.

Allwin21 Corp. was formed in 2000 with a focus on professionally providing Rapid Thermal Process, Plasma Asher Strip / Descum, Plasma Etch/RIE, Sputter Deposition and Metal Film Metrology high-tech semiconductor equipment, services and technical support in Semiconductor III-V, MEMS, Biomedical, Nanotechnology, Solar, Battery & LED industries.

What sets us apart from the competition…

  • Exclusive licensed manufacturer of Heatpulse 610 of AG Associates.
  • Advanced Allwin21 Real Time PC Control Technology.
  • Focus on Production-Proven process technology.
  • Integrated 3-axis solid robotic wafer transfer technology.
  • Experienced local engineer support.
  • Products made in U.S.A

Main Products: RTP | Sputter | Asher | Etcher | Thin Film Metrology

Please contact us by email for more info. We appreciate your time.  


 Products

  • AccuThermo AW 610-The most popular proven RTP
    Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. AG Associates was the dominant manufacturer of RTP systems in 1990’s. ...

  • Allwin21 Corp. is the exclusive licensed manufacturer of AG Associates Heatpulse 610 Rapid Thermal Processing equipment. AG Associates was the dominant manufacturer of RTP systems in 1990’s. The Heatpulse  are still being used around the world in manufacturing, R&D and Universities. These systems have a proven track record for reliability and simplicity.

    The AccuThermo AW610 was derived from the AG Associates 610 production-proven design.  Allwin21 Corp. is the exclusive manufacturer of the AG Associates Heatpulse 610 desktop atmospheric RTP (Rapid Thermal Processing) system.  The system uses high intensity visible radiation to heat single wafer for short process periods of time at precisely controlled temperatures. The process periods are typically 1‑600 seconds in duration, although periods of up to 9999 seconds can be selected. These capabilities, combined with the heating chamber's cold-wall design and superior heating uniformity, provide significant advantages over conventional furnace processing.

    Key Features of AccuThermo AW 610:

    1. 35 years’ production-proven Real RTP/RTA/RTO/RTN system.

    2. Scattered IR light by special gold plated Al chamber surface.

    3. Allwin21 advanced Software package with real time control technologies and many useful functions.

    4. Consistent wafer-to-wafer process cycle repeatability.

    5. Top and bottom High-intensity visible radiation Tungsten halogen lamp heating for fast heating rates with good repeatability performance and long lamp lifetime.

    6. Cooling N2 (Or CDA) flows around the lamps and quartz isolation tube for fast cooling rates

    7. Elimination of external contamination by Isolated Quartz Tube

    8. Up to six gas lines with MFCs and shut-off valves

    9. Energy efficient.

    10. Made in U.S.A.

    11. Small footprint

    Allwin21 Unique Technologies for the best performance (Repeatability, Uniformity,Stability) of desktop RTP.

    1. Derived from the AG Associates 610
    2. Special  Aluminum Chamber with gold plating surface
    3. Special  TOP AND BOTTOM Lamp Assembly Structure
    4. 0.02” Dia “K” Type Thermocouple.
    5. Bare, Beaded touch
    6. Patented ERP Pyrometer, Non-contact -Option
    7. Isolated quartz tube, thickness 0.125” only
    8. Different quartz tray for different substrate
    9. Quartz Liner Plate -Option
    10. Multiple gas lines with MFCs -Option
    11. Proven Carriers / Susceptor -Option
    12. Proven Slip Free Ring -Option
    13. Advanced AW Software with many functions
    14. Precise and Rapid Control
    15. Real Time Control
    16. Easy  Allwin21 Pyrometer Calibration method
    17. Programmable RTAPRO software Calibration
    18. Advanced PID Control
    19. PowerSum function

    Other RTP Models from Allwin21 Corp.

    1. AccuThermo AW 410
    2. AccuThermo AW 810
    3. AccuThermo AW 820
    4. AccuThermo AW 610V
    5. AccuThermo AW 820V

    Please contact us by email for more info. We appreciate your time.

    Keywords: Rapid Thermal Process, Rapid Thermal Processing, Rapid Thermal Anneal, Rapid Thermal Annealing, Rapid Thermal Oxidation, Rapid Thermal Nitride, RTA, RTP, RTO, RTN,, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, AG210, AG310, AG 410, AG610, AG 610I, AG Associates, Heatpulse 210, Heatpulse 410, Minipulse 310, Heatpulse 610, Heatpulse 610I, AG Heatpulse 410, AG Heatpulse 610, AG Heatpulse 210, AG Minipulse 310, Atmospheric Rapid Thermal Process, Vacuum Rapid Thermal Process, Furnace, Oven, Thermal Furnace, Thermal Process, Thermal Processing,JIPELEC, ag2146,JetClip,JetStar, AST SHS2000, AST STEAG 2800,  ssintegration, Rapid Thermal Oxide,JetFirst ,Mattson, annealsys, heatpulse ,ag 2146,Koyo Thermo Systems,AST STEAG-MATTSON 2800, heat pulse, Solaris, Eclipse ,modularpro, RLA-1000, AG Heatpulse,  rapid thermal processor, Steag AST SHS2000, Solaris 75, Solaris75,STEAG Electronic Systems ,eng-sol, Annealsys, RLA-3000, Engineering Solutions ,Solaris 150, Rapid Thermal Annealer , AS-Master ,modularpro,RTO ,Modular  Process Technology, Solaris150,AS-One,AS-Micro

     

  • AW-105R Plasma Asher Descum for III-V Materials
    The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology. ...

  • Allwin21 Corp. has been focusing on providing solutions and enhancements to  plasma asher descum semiconductor process. These OEM asher descum semiconductor equipment have been used in production and R&D since 1990′s. They have been Process-Proven. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid 3-axis robotic wafer transfer system, and new critical components to achieve the goal of giving our customers a production edge.

    The AW-105R single-wafer photoresist asher and descum is an automated tool designed as a flexible 13.56MHz RF Parallel Plate plasma photoresist removal and descum system for high-volume wafer fabrication. The AW-105R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology. Key Features:

    • Production-proven plasma Asher/Descum system.
    • Integrated solid robotic wafer handling, Single wafer process.
    • Up to 3%-5% Uniformity. Best for III-V Materials.
    • Frontside and backside isotropic removal.
    • Consistent wafer-to-wafer process cycle repeatability.
    • Element heating for up to 250o
    • 50mm-150mm wafer capability. Up to 6.25” substrate.
    • Up to 4 wafer size capability without hardware change.
    • Fixed cassette station and wafer aligner/cooling station.
    • Can handle 50um thickness wafer.
    • PC controller with Advanced Allwin21 Software.
    • Endpoint detection (EOP) with Allwin21 SLOPE technology (Optional).
    • Up to 3 gas lines with MFC.
    • Air-Cooled 600W MKS 13.56 MHz RF Generator (300W Option).
    • Pressure control with Throttle Valve.
    • 15-inch Touch screen monitor GUI.
    • EMO, Interlocks, and Watchdog function.
    • GEM/SECS II (optional).
    • Small Footprint: 27”W x 40”D x 59”H (280LBs)
    • Made in U.S.A.

     

    Please contact us by email for more info. We appreciate your time.

    Keywards:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Matrix 105, Matrix 205, Matrix 303, Matrix 403,Matrix 106,Matrix 104, Matrix 102,Matrix 101, Matrix 10,  System One Stripper, Model 105, System One Etcher, model 303, model 403
  • AW-901eR & AW-903eR Plasma Etch RIE
    AW-901eR & AW-903eR Plasma Etcher are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology. ...

  • The AW-901eR & AW-903eR single-wafer dry etchers are automated tools designed as a flexible 13.56MHz RF Parallel Plate plasma etching systems for high-volume wafer fabrication. AW-901eR & AW-903eR are in direct response to manufacturer’s concerns for wafer breakage, Uniformity, Uptime, Reliability, and Production-Proven technology.

    AW-901e AW-903e Key Features:

    1. Production-proven plasma etching system.

    2. Up to 3%-5% Uniformity.

    3. Frontside and backside isotropic and anisotropic etch.

    4. Process Temperature: 6-65°C .

    5. 75mm-150mm wafer capability.

    6. Integrated solid robotic wafer handling. Single wafer process.

    7. Fixed cassette station and wafer aligner/cooling station.

    8. Can handle 50um thickness wafer.

    9. PC controller with Advanced Allwin21 Software.

    10. Endpoint detection with Allwin21 SLOPE technology. (Optional)

    11. Up to 4 gas lines with MFC’s.

    12. MKS 13.56 MHz RF Air-Cooled Generator 300W, 600W, or 1000W.

    13. Pressure control with UPC. Throttle valve is optional.

    14. Touch screen GUI.

    15. EMO, Interlocks, and Watchdog function.

    16. GEM/SECS II (Optional)

    17. Small Footprint

    18. Made in U.S.A.

    Contact us by email for more info. We appreciate your time

    Keywords:Plasma Etcher, Please Etching, Dry Etching, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Tegal 901e, Tegal 903e, Tegal 901e TTW, Tegal 915,Tegal 701,Tegal 703,Tegal 801,Tegal 803,Tegal 981e,Tegal 903e

     

  • Perkin-Elmer 44XX Series Sputter Deposition Equip.
    Allwin21 Corp. has been focusing on providing solutions and enhancements to Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,   Perkin-Elmer 4480 used sputter deposition semiconductor process equipment ...

  • With an installed base of more than thousands of systems, Perkin-Elmer was a leading supplier of sputter deposition equipment for high technology application in 1990's. The Perkin-Elmer 4400 Series, fully refurbished and upgraded by Allwin21 Corp., were designed for flexibility offering a wide range of operating and process modes. The highest quality construction, components and Allwin21's new AW-4450 System Control assure reliable operation and an ultra clean vacuum environment to yield consistently reproducible results. Every fully refurbished and upgraded Perkin Elmer sputtering system was supported by years of technological experience and backed by a worldwide sales and service organization dedicated to prompt courteous service.

    Key Features of Allwin21 Perkin-Elmer 44XX Series Sputter Equipment.

    • Production-proven sputter technology
    • New optimum AW-4450 System Control
    • DC 24V for Motors, Actuator, Relay, Solenoid
    • Efficient 8" Delta cathodes, 2 to 6" option
    • Full Pallet rotation control with “indexing”
    • High Uniformity and Yield
    • DC, RF Sputter, Pulse DC option
    • Magnetron and Diode Sputter option
    • RF Etch and Bias are optional
    • Ultra Clean vacuum system
    • Load lock operation
    • UHV design
    • Flexible for development or production use
    • Full range of substrate sizes and shapes
    • Various pumping and power options
    • Co-sputtering option
    • Reactive Sputtering option

    Please contact us by email for more info. We appreciate your time.

    Keywords:Perkin-Elmer 4400, Perkin-Elmer 4410, Perkin-Elmer 4450,Perkin-Elmer 4480, Perkin-Elmer 2400, Perkin Elmer 4400, Perkin Elmer 4410, Perkin Elmer 4450,Perkin Elmer 4480, Perkin Elmer 2400, Sputter, Magnetron Sputter, Diode Sputter, DC Sputter, RF Sputter, DC Magnetron Sputter, RF Magnetron Sputter, Co-sputter, Reactive Sputter, MRC, MRC 603, MRC 903, MRC 602, MRC 902, MRC 604, MRC 904, MRC 924, Plasma Etch, Dry Clean, Bias Function, Cathode, Load lock, Degas, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment,, Thin Film, Metal Thin Film, Thin Film Deposition, PVD, Physical Vapor Deposition

  • AW-1008 Plasma Asher Semidoncudtor Equipment
    The AW-1008 Microwave Plasma Asher is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology. ...

  • The AW-1008 single-wafer photoresist asher is an automated tool designed as a flexible downstream Microwave plasma photoresist removal system for high-volume wafer fabrication. The AW-1008 is in direct response to manufacturer’s concerns for wafer sensitivity to processing RF damage, uptime, reliability and production-proven technology.

    Key Features:

    1. Production-proven plasma stripper/Asher system technology.

    2. 5-15% Uniformity. (Process & Hardware dependent.Optional.)

    3. Fast strip/ash rate. (Process & Hardware dependent.Optional.)

    4. Increased throughput with 3-Axis Integrated Robust Solid Robot.

    5. Frontside and backside isotropic removal.

    6. 3x 1kW IR Lamp for uniform heating up to 500C.

    7. 75mm-150mm wafer capability.

    8. Endpoint detection w/Allwin21 SLOPE technology (Optional)

    9. 2 wafer sizes capability without hardware change if necessary.

    10. Two Fixed cassette stations.Or, one Fixed & one centering station.

    11. Can handle 50um thickness wafer

    12. PC controller with Advanced Allwin21 Software Package

    13. Up to 4 gas lines with MFC’s

    14. 2.45GHz 1000W Microwave

    15. Pressure control with Throttle Valve

    16. Touch screen monitor

    17. EMO, Interlocks, and Watchdog function

    18. GEM/SECS II interface, Optional

    19. Small Footprint : 35”W x 40”D x 55”H (250LBs)

    20. Made in U.S.A.

    Other Plasma Asher/Descum Equipment from Allwin21 Corp.

    1. AW-105R
    2. AW-B3000

    Please contact us by email for more info. We appreciate your time.

     

    Keywords:Plasma Asher, Plasma Descum, Dry Clean, Downstream Asher,Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Gasonics Aura 1000, Gasonics Aura 2000, Gasonics Aura 3000, Gasonics L3510, Gasonics Aura 3010

  • AW-B3000 Barrel Batch Plasma Asher Equip.
    The AW-B3000 Barrel Batch Asher is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership. ...

  • The AW-B3000 batch/barrel photoresist asher is a manual load tool designed as a flexible 13.56 MHz RF plasma photoresist removal system for high-volume wafer fabrication. The AW-B3000 is in direct response to manufacturer’s concerns for Uptime, Reliability, Production-Proven technology. and low cost of ownership.

    Key Features:

    1. Production-proven plasma Stripper/Asher/Descum technology.

    2. Up to 25% Uniformity. Much lower if used with a Faraday Cage.

    3. Consistent wafer-to-wafer uniformity.

    4. TC Option can be used with an N2 Plasma to heat the wafers up to 170°C (Chamber) to increase ash rate.

    5. End-of-Process (EOP) Option automatically stops the Process after all wafers are fully stripped regardless of wafer quantity or photoresist thickness.

    6. Samples, 6” square, and up to 8” round wafers capable.

    7. Many wafer sizes capability without hardware change.

    8. Can handle different thickness wafer with different carriers.

    9. New controller with PC with Advanced AW Software

    10. Up to 5 isolated gas lines with MFC’s

    11. 13.56 MHz RF Generator.(Air-cooled Optional)

    12. Pressure Control Throttle Valve for better process repeatability.(Optional)

    13. MKS Baratron (Optional)

    14. Touch screen GUI

    15. EMO, Interlocks and Watchdog function

    16. GEM/SECS II (Optional)

    17. Made in U.S.A.

    Please contact us by email for more info. We appreciate your time.

    Keywords:Plasma Asher, Plasma Descum, Dry Clean, Semiconductor Equipment, Used Semiconductor Equipment, Semiconductor Process Equipment, Branson/IPC 2000, Branson/IPC 3000, Branson/IPC 4000, Barrel Asher, Barrel Etch, Barrel Etcher

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