90, Godeok-ro, Godeok-myeon, Pyeongtaek-si,  Gyeonggi-do 
Korea (South)
  • Booth: G001

 - Company introduction

PCB and semiconductors continue to become thinner and thinner. Due to the development of stacked structures, BUMP and TSV (Through Silicon Via) methods have been developed and used for interconnections.

The core technology of this method is the plating process using copper (Cu). The plating solution and additives used in the plating process are the fine chemical field, and foreign multinational companies dominate the market now.

We introduced BUMP & TSV plating solution production process, which was being developed for the first time in Korea, and successfully mass-produced it.

 - Introduce a list of exhibits

Organic additives control the quality of copper plating, including thickness, shape, flatness, uniformity and speed of plating.                                                                            

We will respond quickly to our clients by drawing quick results. Therefore, it is advantageous that mass production is faster than foreign companies.                                                                        

Organic additives imported from foreign countries have a shelf life of only 6 months. However, organic additives manufactured in Korea can be stored for a long time.


  • Wafer bump & TSV Copper plating solution
    High-purity, high-performance copper plating solution for localization of plating solution for semiconductor bump pillar which depends on foreign products...

  • □ Technical achievements

    - localization of bump pillar copper plating product

    - Increasing market through expansion to RDL and PCB

    - Pillar shape that can be changed according to customer's needs

    □ Economic performance (expected performance)

    - Reduction of shipping time and product life through localization

    - Reduction of service cost through domestic research center and production

    - Reduced manufacturing costs by reducing shipping costs through domestic production

  • 8, 12inch Wafer
    - High purity Cu deposition ...

  •  - Excellent uniformity
     - Smooth surface
     - High bath stability
     - Adjustable bump/pillar shape
     - Easy process control & monitoring
     - Long storage time
     - Convenient after-sales service 

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

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