TECHNIC KOREA

Seoul, 
Korea (South)
http://www.technic.com
  • Booth: B534


Hello, This is Technic Korea.

Technic supplies some of the most advanced chemistry solutions for semiconductor packaging applications in the industry.  Technic’s semiconductor advanced packaging electrodeposition chemistries, marketed under the name Elevate, are well respected for innovation and high quality and are used in many applications including RDL, pillars, microbumps and LED packaging.  Technic also supplies, photoresist strippers for liquid and dry film resist as well as metal etchants.

Technic Inc is a Rhode Island based, privately held corporation with over 900 employees worldwide.  For 70 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders and analytical control systems to the electronic component, printed circuit board, semiconductor, industrial finishing and decorative industries.


 Products

  • Elevate® Cu 6340
    Low stress copper bath that can be used for RDL and general purpose semiconductor plating. Plates at 1 – 2 microns/minute with virtually no internal stress....

  • Elevate® Cu 6340 is an electrolytic process especially designed for plating a bright, low stress copper deposit in wafer applications. The bath can be operated 20 to 100 ASF (2-10 ASD) with optimum low stress achieved at 40-60 ASF (4-6 ASD). The electrodeposits produced by the Elevate® Cu 6340 process are fine grained equiaxed, high purity, and ductile copper deposits.
    Elevate® Cu 6340 has been shown to maintain close to zero stress before and after annealing. It is ideal for use in applications where low stress properties of the copper deposit are critical such as glass substrates.
    All of the components in the process are fully analyzable and the Elevate® Cu 6340 process is specifically optimized for control by the Technic EBA or RTA.
    The choice of two electrolytes is provided depending on the plating area of the wafer/substrate. Use Elevate® Cu Electrolyte 40 for low to medium open surface area. Use Elevate® Cu Electrolyte 60 for high open surface area.


    FEATURES AND BENEFITS

    1. Low stress deposit prevents wafer bow or glass cracking.
    2. Plates at high current densities.
    3. Stable additives yielding predictable low additive consumption.
    4. High purity fine grained, equiaxed deposits.
    5. Compatible with high-speed horizontal, vertical plating, or Semcon plating equipment.
    6. Easily controlled by Technic EBA/RTA, and/or auto-dosing.

  • Elevate® Gold 7990
    Electrolytic non-cyanide gold process that produces pure, soft gold deposits....

  • Electrolytic non-cyanide gold process that produces pure, soft gold deposits. Offers several advantages over standard sulfite gold baths including neutral pH, no metallic grain refiners, longer bath life, exceptional throwing power and a very stableelectrolyte.

    FEATURES AND BENEFITS:
    1. High cathode efficiency.
    2. Low internal stress.
    3. Neutral pH for optimum compatibility with plating resist
    4. Deposit can be modified for different applications
    5. Cyanide free solution
    6. Compatible with standard industry plating tools


    DEPOSIT CHARACTERISTICS
    Deposit is semi-bright to bright
    Deposit purity: 99.99% gold (minimum)

  • Real Time Analyzer - 3D
    This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness....

  • Real Time Analyzer - 3D
    Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The redesigned RTA3D enhancements allow the system for more customization of experimental conditions, software, and applications.


    Features and Benefits
    • State-of-the-art of electronic components
    • Innovative electrochemical techniques
    • Intuitive Graphical User Interface
    • Design based on field experience and customer input
    • Virtually consumable free
    • Automatic temperature correction capabilities
    • Open software architecture allowing advanced customization and integration

  • TechniEtch TBR19
    Fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers....

  • Fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers.
    TBR19 has demonstrated extremely high selectivity for Ti or Ti alloys over copper, resulting in a significant reduction in undercut (<200 nm) in Cu pillar applications.

    • For Ti and alloy etchant

    • Ready to use & POU, high uniformity WtW, WiW

    • Fluoride free aqueous solution

    • Better proccess control- upt o 80% overetching with minimum undercut features

    • Selective Titanium (Ti) and alloys (TiN, TiW) based barrier etchant

    • Compatible with most UBM, and copper pillar integration materials such as Cu, Al, Ni, Sn & alloys, Glass, organic substrate, etc.

  • TechniStrip® NF52
    Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper...

  • TechniStrip® NF52
    A highly effective negative tone photoresist remover used mainly for advanced packaging applications.
    Developed to remove laminated photoresist and liquid resins, the novel stripping formulation of this TMAH/DMSO chemistry exhibits high dissolution performance and excellent metal compatibility compared to standard TMAH based blends.

    • Hard disk
    • Fragile substrate stripping
    • Wafer Reworking
    • WBR2010, 2100 dissolution
    • Laminated film stripping
    • Negative and positive tone dissolution

  • TechniStrip® P1331
    An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layerreworking. Ideal for use in back end applications like TSV, Cu pillar, bumping, etc....

  • Technistrip® P1331 offers complete resin dissolution of thick film photoresist such as THB151N, THB121N, AZ125XT, etc. In addition Technistrip® P1331 is fully compatible with Dryfilm resist such as WB2000 series.


    Technistrip® P1331 utilizes a novel cleaning formulation that has been proven to provide a loading capacity three times higher than a standard TMAH based blend. Additional advantages of the Technistrip® P1331 are its very high material compatibility and safety compared to standard TMAH based blends. The intrinsic nature of the additives and solvent make the blend totally compatible with metals used throughout the BEOL interconnects to WLP bumping applications.


    FEATURES AND BENEFITS
    1. Very high stripping rate, >10μm/min
    2. Complete resin dissolution
    3. Enhanced resin loading capacity
    4. Low evaporation rate, < 3 cc/hour/dm2
    5. High metal compatibility, <2A/min @60°C
    6. Complete water miscibility
    7. Suitable for batch (spray and immersion) and single wafer systems
    8. Low odor compared to standard DMSO/TMAH resist strippers
    9. Safety: Free of NMP and Hydroxylamine

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and Fairguide.com or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.

For Technical Support with this webpage, please contact support.