Fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers.
TBR19 has demonstrated extremely high selectivity for Ti or Ti alloys over copper, resulting in a significant reduction in undercut (<200 nm) in Cu pillar applications.
• For Ti and alloy etchant
• Ready to use & POU, high uniformity WtW, WiW
• Fluoride free aqueous solution
• Better proccess control- upt o 80% overetching with minimum undercut features
• Selective Titanium (Ti) and alloys (TiN, TiW) based barrier etchant
• Compatible with most UBM, and copper pillar integration materials such as Cu, Al, Ni, Sn & alloys, Glass, organic substrate, etc.