EV Group Korea

Gyeonggi-do, 
Korea (South)
http://www.EVGroup.com
  • Booth: C336


Welcome to visit us at Booth # C336 for EV Group (EVG).

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.


 Press Releases

  • 보도자료

    EV 그룹, 무어의 법칙 이상의, 미세화와 전공정을 위한

     차세대 퓨전 웨이퍼 본딩 장비 출시

    새로운 BONDSCALE™시스템, 웨이퍼 본딩 생산성을 대폭 향상하고

    IRDS 로드맵 추진과 관련한 로직 트랜지스터 스케일링 및 3D 통합 작업 과제들 해결

    2019 1 22 MEMS, 나노 기술, 반도체 제조용 웨이퍼 본딩 및 리소그래피 장비 분야의 선도적인 공급 업체인 EV 그룹(이하 EVG)은 완전히 새로워진 자동화 생산 퓨전 본딩 시스템인 ‘BONDSCALE™’을 출시한다고 밝혔다. BONDSCALE은 모놀리식 3D(M3D) 같은 레이어 전이 공정 기술을 활용하는 첨단 공업용 기판 제조 및 3D 통합 방식 등 광범위한 퓨전/분자 웨이퍼 본딩 애플리케이션에 활용될 수 있도록 설계됐다. 이번 BONDSCALE 출시를 통해, EVG는 웨이퍼 본딩 기술을 프런트엔드 반도체 처리 공정에 제공함으로써, IRDS(International Roadmap for Devices and Systems)가 ‘무어의 법칙’ 이상으로 로직 디바이스를 향상시키고자 할 때의 과제들로 오래 전부터 거론해 온 문제들을 해결하는 데 기여했다. 더욱 강화된 엣지 정렬 기술을 채용함으로써, BONDSCALE은 기존 퓨전 본딩 플랫폼에 비해 웨이퍼 본딩 생산성이 크게 향상됐으며, 소유 비용(CoO)도 크게 낮아졌다. 고객에 대한 장비 선적은 이미 시작됐다.

    BONDSCALE은 EVG의 업계 선도적인 GEMINI® FB XT 자동화 퓨전 본딩 시스템과 함께 판매되고 있으며, 각각의 플랫폼은 서로 다른 용도에 초점이 맞춰져 있다. BONDSCALE은 기본적으로 첨단 공업용 기판 본딩 및 레이어 전이 공정에 주력하게 되며, GEMINI FB XT는 메모리 적층, 3D 시스템온칩(SoC), BIS CMOS 이미지 센서 적층, 다이 파티셔닝 같이 보다 높은 정렬도가 요구되는 애플리케이션을 지원할 예정이다.

    반도체 성능 확장의 핵심 열쇠인직접 웨이퍼 본딩기술

    IRDS 로드맵에 따르면, 기생 미세화(parasitic scaling)는 향후 로직 디바이스 성능에 있어서 핵심 구동력이 될 것이며, 새로운 트랜지스터 아키텍처와 재료를 필요로 할 것이다. 또한 IRDS 로드맵은 M3D 같은 새로운 3D 통합 접근법은 기존 2D 반도체를 예컨대 후면 열 발산, N&P 적층, 로직-온-메모리, 클러스터형 기능 적층, beyond-CMOS 채택 등의 3D VLSI로 서서히 전환해 나가는 데 필요할 것으로 밝히고 있다. 레이어 전이 공정과 첨단 공업용 기판은 디바이스 성능, 기능성, 전력 소모 면에서 상당한 향상을 제공함으로써 로직 규모를 확대할 수 있게 해준다. 플라즈마 활성화 기술을 이용한 직접 웨이퍼 본딩은 서로 다른 재료들과 첨단 공업용 기판, 얇은 실리콘 레이어 전이 애플리케이션 간 이종간 집적화를 가능하게 해주는 검증된 방법이다.

    EVG의 폴 린드너(Paul Lindner) CTO는 “웨이퍼 본딩 분야의 세계적인 선도기업인 EVG는 고객들이 새로운 반도체 기술을 초기 R&D 단계에서부터 최종 생산단계까지 적용할 수 있도록 하는 데 앞장서 왔다”며, “25년 전, EVG는 틈새 시장용 고주파 및 방사선 경화 방법을 디바이스 생산에 활용할 수 있는 업계 최초의 SOI(silicon-on-insulator) 웨이퍼 본딩 장비를 출시한 바 있다. 그 이후로, 우리는 고객들이 첨단 공업용 기판의 이점을 보다 폭넓은 애플리케이션에서 활용할 수 있도록 하기 위해 EVG 직접 접합 플랫폼의 성능과 CoO를 지속적으로 강화해 왔다. 이번에 새롭게 출시한 BONDSCALE 솔루션은 한층 더 높은 수준의 생산성을 구현함으로써, 무어의 법칙 그 후의 시대를 위한 차세대 로직 및 메모리 디바이스가 지속적으로 추구하는 보다 우수한 성능, 전력 소모, 면적 축소가 가능하게 해주는 첨단 공업용 기판 및 레이어 전이 공정에 대한 증가하는 수요를 충족한다.

    BONDSCALE은 FEOL(Front-End-Of-Line) 애플리케이션에 요구되는 퓨전/직접 웨이퍼 본딩용 대량 생산 시스템이다. EVG의 LowTemp™ 플라즈마 활성화 기술이 특징인 BONDSCALE 시스템은 세정, 플라즈마 활성화, 정렬, 사전 본딩 및 IR 검사 등 퓨전 본딩에 필요한 모든 핵심 조치들을 단일 플랫폼에 통합하고 있어, 광범위한 퓨전/분자 웨이퍼 본딩 애플리케이션에 이상적이다. 이 시스템은 200mm와 300mm 웨이퍼 모두를 처리할 수 있어 보이드가 없는(void-free) 높은 생산성의 고수율 생산 공정을 보장한다.

    BONDSCALE은 차세대 퓨전/직접 본딩 모듈과 새로운 웨이퍼 핸들링 시스템 및 광학 엣지 정렬을 통합함으로써, 첨단 공업용 기판 웨이퍼 생산과 M3D 통합을 추진하고자 하는 고객들에게 매우 높은 수준의 생산성을 제공한다.

    첨단 공업용 기판 및 프런트엔드 웨이퍼본딩을 위한 BONDSCALE 자동화 퓨전 생산 본딩 시스템에 대한 보다 자세한 내용은 https://www.evgroup.com/en/products/bonding/integrated_bonding/bondscale/에서 확인할 수 있다.

    EV 그룹에 대해(EVG)

    EV 그룹(EVG) 은 반도체, MEMS, 화합물 반도체, 파워 디바이스 그리고 나노기술 장치들을 제조하기 위한 세계적인 장비 및 공정 솔루션 전문 기업이다. 웨이퍼 본딩, 얇은 웨이퍼 처리 기술, 리소그래피 / 나노 임프린트 리소그래피 (NIL) 및 계측기기를 포함한 주요 제품 이외에도 포토 레지스트 코터, 웨이퍼 세정장비 및 검사 시스템을 제조 생산하고 있다. 1980년 설립된 EV 그룹은 글로벌 고객들과 파트너들을 위한 서비스와 협력지원을 위해 정교한 네트워크를 구축해 놓고 있다. EVG에 대한 보다 더 자세한 정보는 웹사이트 www.EVGroup.com에서 확인할 수 있다.

    또한, EVG는 고객의 니즈에 소통하고자 국내 반도체 산업 대표 박람회인 SEMICON KOREA 2019에 참가하여 부스를 오픈하고

    2019년1월23일 수요일부터 1월25일 금요일까지 삼성동 COEX 3층 C 홀 BOOTH NO. C336 에서 직접 만나볼 수 있다.

    문의:
    Sales                              
    EV Group Korea                                                                                   
    Tel: 0232184413                                                                 
    E-mail:
    Sales@EVGroup.co.kr                                           

    # # #


 Products

  • EVG®850TB/DB (XT Frame)
    Automated Temporary Wafer Bonding...

  • Description: Debonding Systems. Next-generation thin wafer processing for high-volume 3D IC manufacturing, Based on EVG’s new XT Frame equipment platform

    Details:

    Built on the company’s XT Frame platform, the new EVG®850TB/DB systems double the throughput over EVG’s previous-generation, industry-benchmark equipment platform to up to 40 stacks per hour. The systems enable the highest productivity, repeatability and yields in thin-wafer processing. Designed for EVG’s open materials platform approach, the EVG®850TB/DB support a wide range of adhesives from various materials suppliers, providing customers with the most flexible choice of temporary bonding materials.

    Features:

    • Highly efficient continuous mode operation (zero idle time)

    • Ultra-fast handling system

    • Up to nine process modules

    • Up to 4 FOUP load ports

    • Up to 10 additional FOUPS in a Local Foup Storage System

    • In-line metrology module option enables real-time monitoring of bonding/debonding process

    • Qualified for a wide range of bonding and debonding processes, including low temperature debonding methods like ZoneBOND®

  • IQ Aligner® NT
    Automated Mask Alignment System...

  • Description:

    Automated Mask Alignment System

    Details:

    The new IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG's previous-generation IQ Aligner system. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems. It is ideally suited for wafer bumping and interposer patterning serving a variety of advanced packaging types, including Wafer-level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), 3D-IC/Through-silicon Via (TSV), 2.5D Interposers, and Flip Chip.

    Enhanced Performance

    Semiconductor advanced packaging is continually evolving to enable new types of devices with increasing functionality at a lower cost per function. As a result, new developments in lithography are required to address the unique needs of the advanced packaging market. The new IQ Aligner NT addresses the most challenging requirements of advanced packaging lithography with the best technical performance data combined with extraordinary productivity.

    • First-rate throughput
      • First Print >200 wph
      • Topside Alignment >160 wph
      • Backside Alignment >160 wph
    • Cutting-edge alignment accuracy
      • Topside Alignment ≥ 250 nm
      • Backside Alignment ≥ 500 nm
    • High power lamp house
      • Broad band intensity >120 mW/cm²
      • i-line intensity > 65 mW/cm²


    New Capabilities

    The IQ Aligner NT incorporates a number of technical improvements and unique features to address a variety of industry needs as well as enable advanced process control.

    • Dual substrate size concept
      • Handles different mask sizes with no retooling efforts and no adapter frames required - provides a quick and easy bridge tool
    • Full clearfield mask movement
      • Highest process compatibility and flexibility in alignment pattern positioning
      • Facilitates processing with dark field masks
    • All contact-free processing
      • Contact-free wafer wedge error compensation (WEC)  
      • Contact-free process photo mask gap calibration
    • Run-out compensation
      • Ultra-flat temperature-controlled wafer chuck
    • Manual mask and wafer-loading capabilities
      • Allows manual wafer loading on systems configured with robot handling
  • EVG®7200 LA SmartNIL®
    SmartNIL®-based Nanoimprint Lithography System...

  • Description:

    SmartNIL®-based Nanoimprint Lithography System

    Details:

    The EVG7200 Large-Area UV Nanoimprint System allows imprinting on Gen 2 (370 mm x 470 mm) panel size substrates. The SmartNIL-based system is ideally suited to leverage nanotechnology for panel manufacturing. For applications like displays, biotechnology and photonic elements, which cannot be reduced in size, it is crucial to increase the substrate utilization efficiency by increasing the pattern area. NIL has proven to be the most cost-efficient way to enable fabrication of nano patterns on large areas as it is not limited by optical systems and can provide the best pattern fidelity for the smallest structures.
    SmartNIL provides superior conformal imprint results down to 40 nm utilizing a very robust and controllable tooling.

    Features

    • Nanopatterning down to 40 nm on panel-size substrates
    • Robust and precisely controllable processing
    • Optimized high-power UV curing sequence for panel substrates
    • Fully automated imprinting and controlled low-force detachment for maximum working stamp reusability
    • Proprietary SmartNIL technology is a scalable and robust technology fulfilling industry needs
    • SmartNIL provides unmatched conformal imprinting over large areas
    • Volume-proven imprinting technology with superior replication fidelity
    • Uniform large-area imprint with high process flexibility
    • Multiple-use polymer stamp technology for longest master lifetime and significant cost savings
  • EVG®40NT Measurement System
    Automated Measurement System...

  • Product: EVG®40NT


    Description: Automated Measurement System

    Product Detail: Versatile Metrology for Bonding and Lithography

    The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.
    Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.

    In addition to vertical measurement, the EVG40 NT / AVM also operate at a high resolution in the lateral direction, making them suitable for alignment verification measurements and 3D applications.
     

    Key Features

    • Versatile measurement options for lithography and bonding metrology
    • Alignment verification for bonding and lithography applications
    • Critical dimension (CD) measurement
    • Die-to-die alignment verification
    • Multi-layer thickness measurement
    • High measurement accuracy in vertical and lateral direction
    • High throughput due to specialized calibration routine
    • PC-based measurement and pattern recognition software for highest reliability
  • EVG®560 Wafer Bonding System
    Automated Wafer Bonding System...

  • Product : EVG®560

    Description: Automated Wafer Bonding System

    Product Detail:

    The EVG560 Automated Wafer Bonding System accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

    Features

    • Fully-automated processing with automated loading and unloading of bond chucks
    • Up to four bond chambers for various bonding processes
    • Automatic loading and unloading of bond chambers and cooling station
    • Remote modem diagnostics
  • BONDSCALE™ Fusion Bonding System
    Automated Production Fusion Bonding System...

  • Product : BONDSCALE™

    Description: Automated Production Fusion Bonding System

    Product Detail:

    EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

    BONDSCALE is being sold alongside EVG's industry benchmark GEMINI FB XT automated fusion bonding system, with each platform targeting different applications. While BONDSCALE will primarily focus on engineered substrate bonding and layer-transfer processing, the GEMINI FB XT will support applications requiring higher alignment accuracies, such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning.

    Features & Applications 

    • Fully-automated fusion/molecular wafer bonding applications on 200 and 300 mm in a single platform, including cleaning, plasma activation, alignment, pre-bonding and IR inspection
    • Direct wafer bonding with plasma activation for heterogeneous integration of different materials, high-quality engineered substrates as well as thin-silicon layer transfer applications
    • Layer transfer processes and engineered substrates enabling logic scaling, 3D integration such as M3, 3D VLSI including backside power distribution, N&P stacking, logic-on-memory, clustered functional stacks and beyond-CMOS adoption

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