KYZEN

Nashville,  TN 
United States
http://www.kyzen.com
  • Booth: C537


KYZEN Cleaning Experts Available Onsite!

KYZEN has been pioneering award-winning environmentally responsible advanced cleaning technologies since 1990 by fusing our commitment to groundbreaking science in cleaning chemistries and research with the care we have for your manufacturing cleaning process and your success. That means we continuously improve our cleaning agents and problem solve to create the most effective cleaning products and solutions to suit your specific needs. And, we are meticulous in our attention to detail in meeting those manufacturing cleaning needs, tackling it head on and sticking with it until it is successfully resolved.


 Products

  • Micronox® MX2322
    Semiconductor & Advanced Assembly Cleaning Solutions...

  • Micronox® MX2322 is a semiconductor grade engineered semi aqueous solvent and designed to clean all types of paste fluxes common in wafer bumping, wafer level packaging, die attach, flipchip and SiP that contain copper pillar. Micronox MX2322 has a wide process window, as well as a long bath life, to remove tough flux residue at a fast rate and is compatible with all sensitive metals. Micronox MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

    • Effective in Single Wafer SIA, Ultrasonic and all Immersion Cleaning Systems
    • Compatible with Sensitive Metals and Passivation Materials
    • Effective on All Types of Residues on Lead Free & High Pb Process
    • Wide Process Window
    • Low Cost Ownership
  • Micronox® MX2707
    pH Neutral Advanced Packaging Cleaning Chemistry...

  • Micronox® MX2707 is a neutral range pH chemistry designed for Flip Chip, Package on Package and Chip Scale Packages and is particularly effective on copper pillar technology. MX2707 most effectively cleans organic acid flux residues at lower concentrations and effectively cleans under highly dense die without reacting with exposed metals, such as Cu, Al, Sn, Ni, and Ag finishes or damaging substrates. Collectively, these unique properties position MX2707 to be a universal cleaner for advanced packages.

    • Effectively cleans under highly dense die
    • Will not attack or corrode unexposed metal and intermetallic alloys
    • SAC, Aluminum and Copper safe
    • Lowers surface tension
    • Environmentally Friendly

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and Fairguide.com or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.

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