Micronox® MX2707 is a neutral range pH chemistry designed for Flip Chip, Package on Package and Chip Scale Packages and is particularly effective on copper pillar technology. MX2707 most effectively cleans organic acid flux residues at lower concentrations and effectively cleans under highly dense die without reacting with exposed metals, such as Cu, Al, Sn, Ni, and Ag finishes or damaging substrates. Collectively, these unique properties position MX2707 to be a universal cleaner for advanced packages.
- Effectively cleans under highly dense die
- Will not attack or corrode unexposed metal and intermetallic alloys
- SAC, Aluminum and Copper safe
- Lowers surface tension
- Environmentally Friendly