Lasertec Korea Corporation

Hwaseong-si,  Gyeonggi-do 
Korea (South)
http://www.lasertec.co.jp
  • Booth: D526


"Create unique solutions. Create new value."

The origin of Lasertec Corporation dates back to 1960 when Yasushi Uchiyama founded a small firm to develop X-ray television systems. For 50 years since its inception, Lasertec has grown steadily, bringing a number of innovative inspection and measurement systems to market, guided by the corporate philosophy, “Create unique solutions. Create new value.”

We are now taking a fresh step toward achieving our vision of the current medium term: “Be the first point of contact for our worldwide customers searching for solutions.” We appreciate our customers' high expectations for our capability, especially for our core technology and product development in the area of state-of-the-art inspection systems for semiconductor and FPD industry applications.

Our mission is to be the front runner of the optical technology field and help customers overcome new challenges arising from continuing innovations. It is our resolve that we keep growing through creation of unique solutions and new value for our customers while maintaining high profitability and reinforcing financial strength in the process, so that we can contribute more to global prosperity.


 Products

  • Mask Blanks Inspection and Review System MAGICS
    M9650/M9651 is the latest model of advanced defect inspection system attaining both high sensitivity for the next-generation high-quality mask blank inspection and high throughput for incoming and outgoing inspection at production facilities....

  • Mask Blanks Inspection and Review System MAGICS Series M9650/M9651 is the latest model of advanced defect inspection system attaining both high sensitivity for the next-generation high-quality mask blank inspection and high throughput for incoming and outgoing inspection at production facilities. Based on the core technology of MAGICS which has already become the industry standard machine for mask blank inspection, M9650 using the high-speed inspection circuit technology cultivated with our company's mask pattern inspection equipment and the renewed inspection optical system. It achieved significantly higher sensitivity not only for defects on substrates but also for defects on each layer of cutting-edge semiconductor mask blanks, thereby enabling the more stringent qualification of blanks. M9650 is compatible with multi-slot cassettes for blank manufacturers, RSP and MRP for mask shops, and dual pods for EUVL. And also applicable to line & space monitor pattern inspection and offers an effective tool for various process management needs at mask shops.
  • Phase-Shift,Transmittance Measurement System MPM
    Phase-Shift, Transmittance Measurement System MPM193EX is an industry defacto standard measurement system that measures phase shift and transmittance of EPSM and APSM. MPM193EX measures Phase shift over a micro area of 1um scale or less....

  • Phase-Shift, Transmittance Measurement System MPM193EX is an industry defacto standard measurement system that measures phase shift and transmittance of EPSM and APSM. MPM193EX measures Phase shift over a micro area of 1um scale or less. It can measure Masks with pellicle mounted. And auto inspection function is significantly improved compared with that of the conventional system.
  • TSVback Grinding Process Measurement System BGM300
    TSV Back Grinding Process Measurement System BGM300 measures TSV depth based on a combination of Lasertec-proprietary interferometer and IR optics. BGM300 is applicable to measurements in both pre- and post-back grinding processes....

  • TSV Back Grinding Process Measurement System BGM300 measures TSV depth based on a combination of Lasertec-proprietary interferometer and IR optics. BGM300 is applicable to measurements in both pre- and post-back grinding processes. Also, it measures Silicon thickness and TSV depth prior to back-grinding of TSV wafers and remaining silicon thickness(RST) after the back-grinding of TSV wafers. BGM300 can detect the abnormal adhesive thickness of bonded wafers.
  • Mask Inspection System MATRICS X8ULTRA Series
    MATRICS X8ULTRA Series feature high sensitivity and throughput at the lower cost of ownership targeted for the latest 7nm and 5nm technology nodes. It achieved high sensitivity with 45nm pixel size, 213nm QCW laser, and two polarized illuminations....

  • MATRICS X8ULTRA Series feature high sensitivity and throughput at the lower cost of ownership targeted for the latest 7nm and 5nm technology nodes EUV and optical masks. X8ULTRA achieved high sensitivity with a pixel size of 45 nm, a high power 213 nm QCW laser (> 400 mW), and two types of polarized illumination.  mask to mask comparative inspection function (MtM function) that stores all the images of the mask pattern in the initial state and detect defects on the mask by comparison with the mask pattern after the wafer exposure is carried. CD uniformity check and the map output can be carried out simultaneously with defect inspection. MATRICS X8ULTRA Series also compatible with RSP150 and RSP200 for dual, optical pods for EUV reticles.
    A mask to mask comparative inspection function (MtM function) that stores all the images of the mask pattern in the initial state and detects foreign matter on the mask by comparison with the mask pattern after the wafer exposure is carried.
  • EUV Mask Blanks Inspection and Review System ABICS
    EUV Mask Blanks Inspection and Review System ABICS E120 Detects printable phase defects and enabling defect management for EUV mask blanks through wavelength 13.5nm(EUV) laser. It is possible to measure phase defects of width 50nm and height 1nm....

  • EUV Mask Blanks Inspection and Review System ABICS E120 Detects printable phase defects and enabling defect management for EUV mask blanks through wavelength 13.5nm(EUV) laser. It is possible to measure phase defects of width 50nm and height 1nm. The inspection time is 45minutes based on 142mm x 142mm. ABICS E120 can locate and review defects using dark field and bright field optics.

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