MiCo Co., Ltd.

Anseong-ci,  Gyeonggi-do 
Korea (South)
  • Booth: A128

global Engineering Company / Chamber Solution Provider


MiCo: Global Engineering Company / KoMiCo: Chamber Solution Provider

MiCo was founded in February 1996, and spun off into a separate company, MiCo and KoMiCo in 2013.

As a leading company providing semiconductor parts and various materials, We are always trying to become an expert in global materials and parts industries by creating the value for customers based on convergence of core component technologies such as Y2O3, Al2O3 and AlN.

MiCo continuously strives to contribute to the semiconductor industry by expanding our business area of functional parts and advanced materials. Going forward, MiCo committed to green industry on developing solid oxide fuel cell and IT industry by using precise and functional parts based on our advanced ceramic technology.

KoMiCo, a leading company of precision cleaning and specialized coating in semiconductor industry, intends to become a global leader not only in semiconductor industries but also in all IT and a frontier industries with our advanced cleaning and coating technology.


  • Heater
    - 히터 개발의 주요 요인 1. 히터 온도 균일성 향상(윤곽선 지도 ≤ 2°C의 경우) 2. 고온에서 볼륨 저항성이 높은 AlN(E Chuck 기능 및 고온의 경우) 히터(@700°C)) 3. 상부 유전체 두께 균일성(좋은 증착 균일성, 두께 범위 ≤0.1mm) 4. 세라믹 분해의 경우 AlN 개선(Pluasma Resistance의 경우)...

  • - Key Factors of Heater Development

     1. Improved Heater Temperature Uniformity (for Contours Map 2)

     2. High Volume Resistivity AlN at High Temperature (for E Chuck Function & High Temp. Heater (@700))

     3. Upper Dielectric Thickness Uniformity (for Good Deposition Uniformity, Thickness Range 0.1)

     4. Improved AlN for Ceramic Degradation (for High Plasma Resistance)

     5. Low Thermal Conductivity AlN for Shaft Bonding Technology (for High Temperature Heater (@700))

     6. Reproducibility of Heater to Heater (for Tool Matching, Constant Temperature of Wafer)

     7. Brazing Technology with High Strength

     8. Terminal with Flexible Wire

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