- Company introduction
PCB and semiconductors continue to become thinner and thinner. Due to the development of stacked structures, BUMP and TSV (Through Silicon Via) methods have been developed and used for interconnections.
The core technology of this method is the plating process using copper (Cu). The plating solution and additives used in the plating process are the fine chemical field, and foreign multinational companies dominate the market now.
We introduced BUMP & TSV plating solution production process, which was being developed for the first time in Korea, and successfully mass-produced it.
- Introduce a list of exhibits
Organic additives control the quality of copper plating, including thickness, shape, flatness, uniformity and speed of plating.
We will respond quickly to our clients by drawing quick results. Therefore, it is advantageous that mass production is faster than foreign companies.
Organic additives imported from foreign countries have a shelf life of only 6 months. However, organic additives manufactured in Korea can be stored for a long time.