Rigaku Corporation

  • Booth: A464


RIGAKU - Leading with Innovation

Since its inception in Japan in 1951, Rigaku has been at the forefront of analytical and industrial instrumentation technology. In fact, Rigaku means physical science in Japanese, the core of instrumentation. With hundreds of major innovations to its credit, Rigaku and its subsidiary companies are world leaders in the fields of protein and small molecule X-ray crystallography, general X-ray diffraction, X-ray spectrometry, semiconductor metrology, automation, cryogenics and X-ray optics. Rigaku employs over 1,000 people worldwide in the manufacture and support of its analytical equipment. Whether supplying the tools to create better semiconductor chips, enabling drug discovery, improving production line quality, or exploring the new frontier of nanotechnology, Rigaku products and services lead with innovation. Rigaku was chartered to be the world's leading X-ray analytical instrumentation company.


 Products

  • WX310
    반도체용 형광 X-선 분석장치 - Wafer size : up to 300mm - Multi layer film analysis - 동시 분석 film thickness and composition - FOUP (SMIF) 장착 가능 - Multi point measuremment - GEM 300 대응...

  • - 분석 원소: 4Be~92U
    - 300 mm사이즈까지의 웨이퍼상의 각종 박막의 두께와 조성 측정
    - X-Y-θ-Z구동 방식
    - 4 kW의 고파워 X-선관
    - 금속막 측정을 위해 70μm의 조사 spot 사이즈의 X선원을 미소 부위나 edge부분까지의 막 두께 및 조성 분석 가능
    - 반도체 공정: BPSG, SiO2, Si3N4, Doped polySi(B, P, N, As), Wsix, Al-Cu, TiW, TiN, TaN, PZT, BST, SBT, MRAM
    - 금속막: Mo, Ti, Co, Ni, Al, Cu, Ir, Pt, Ru 등
    - 자기 디스크: CoCrTa, CoCrPt, DLC, NiP 등
    - 광학 자기 디스크: Tb-FeCo 등
    - 자기 헤드: GMR, TMR 등
    - FOUP/SMIF interface
    - 200 mm/300 mm 대응
    - AMHS에 대응 및 SECS/GEM 프로토콜의 대응
  • MFM310
    인 라인 X선 메탈 필름 모니터 MFM 310 - 프로세스 웨이퍼 대응이 가능한 마이크로 빔 사이즈 - X–선 반사율(XRR) 측정을 통한 막질 두께, 밀도 측정 - 형광 X-선(XRF) 측정을 통한 막질 조성 및 두께 측정 - X-선 회절(XRD) 측정...

  • - 프로세스 웨이퍼를 고 throughput로 측정  박막의 뚜께 ·밀도를, 대기중· 비접촉으로 빠른 throughput(1 – 20WPH) 측정. 테스트 웨이퍼가 불필요하게 됩니다.
    -  패턴 인식 기능 탑재 프로덕트 웨이퍼상 100 마이크로 미터 이하의 미세 패턴상에서, 임의인 측정 위치를 설정 가능합니다.
    -  고정밀도와 고 throughput를 양립 108 까지의 다이나믹 레인지를 가지는 고속 APD 검출기를 탑재, Micro-XRR, Micro-XRF 모두, 고정밀도 측정과 고throughput 측정을 가능하게 했습니다.
    - 낮은 도입 코스트, 낮은 런닝코스트(Running Cost)를 실현 전력 절약형 X선관 COLORS, COLORS-i를 채용, 저전력 소비 및 낮은 유지비용에 의해, 연간 런닝코스트(Running Cost)_를 최소화 했습니다.
    - 웨이퍼면 비밀옷감 평가 200mm, 300mm 웨이퍼를 4축시료대에 수평 지지해, 웨이퍼 엣지까지의 전면 자동 매핑 측정에 대응합니다.
    - 어플리케이션 FEOL, CoSix, NiSix, SiGe, High-k막질, Low-k 막질 및 다양한 베리어 메탈(Ta/TaN, Ti/TiN, Cu)등의 프로세스에서, 광범위한 막질에 대응 가능합니다.
  • TXRF3800
    TXRF 3800e - Sealed tube 를 적용하여 기존 high power TXRF 보다 저렴 - Sapphire application 및 소형 시료 측정에 적합 - 반도체, 환경 등의 극미량 오염 원소 분석...

  • - Silicon wafer, sapphire wfer, glass wafer 등 적용 가능
    - X-Y-Θ의 시료 Stage 장치(특허 출원중)
    - 2개의 Monochromator 장치와 robot에 의한 Wafer handling
    - Seal tube type 적용
    - Sweeping software 를 이용한  wafer 전면 mapping 측정 가능
    - 탁월한 interface
    - PL-Link 가능

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