We offer a variety of deposition processes and various films with wafer of research and development applications involved in the semiconductor manufacturing process.
Rich processing menu of specialized manufacturer unique will meet the various needs of customers.
In addition, its own normal or super-thick thermal oxide film formation technology is the material that is essential
to the bumping process and optical device.
Our products and technologies have been adopted to communication semiconductor equipment
manufacturers and optical component manufacturers worldwide.
SOI（Silicon on Insulator）Wafer is a silicon wafer which is a structured single crystalized layer on oxidized layer and used in the field of high speed LSI, low power LSI, power device, MEMS. Except for normal SOI, we provide special SOI wafer such as Cavity SOI wafer or Thick BOX SOI wafer. Cavity SOI will be a good performance on reducing process steps or yield loss, and this would be the possibility for reducing huge cost cutting. Also, Thick BOX SOI wafer is made by KST’s unique super thick thermal oxidized layer technique which has never been existed before, and possible to make silicon photonics, or super high resistivity power device in the world