TSE Co., Ltd.

Korea (South)
  • Booth: A718

Semiconductor & OLED Total Test Solution

The Best Partner, TSE!

"Delivering the promise of value-added innovation and technology to test."

TSE has been grown up with semiconductor industries since TSE was founded in 1994. TSE has developed test interface system, load board, test socket and probe card which are necessary for semiconductor test and has supplied to semiconductor chip makers worldwide. Moreover, TSE has creates true value together with the customers by developing various types of TOB( Tester On Board) which improve the performance of existing ATE system.

TSE operates MEMS production line, and produces wide range of products. the product items are MEMS Probe Card, MRC(MEMS Rubber Socket), OLED MEMS Unit, MEMS Inductor, MEMS Relay, etc.

TSE supplies load board and test sockets required for SoC and Logic semiconductor devices, but also supplies handler equipment.

Based on those technologies, TSE contributes all our effort continuously to be a company to create new value consistently together with customers. We ask you a favor of your warm support and interest to TSE which makes a new take-off.


  • Probe Card (HPC)
    HPC (High Performance Probe card)...

    • 1 Touch Down for 300mm wafer test
    • High parallelism test solution up to 1,500para
    • Pin count up to 35,000pins
    • Automatic Probe bonding
  • Load Board
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide....

  • * V93K 769BGA Dual Site Final Test Load Board (Picture)

    * ATE design library - V93K, T2000, Ultraflex, J750 and many more testers.

    * Accumulated PCB design know-how for 25 years and SI/PI simulation capability

    * TSE has owned PCB Fab and ass'y and test line in house.

    * TSE provides load board including stiffener frame and test socket as a turnkey solution.

  • TDMS-1000 / TDMS-2000
    HVM OS Test Monitoring & analytical instrument for Wafer Sort, Package Test and Strip Tset on Bumping or Wafer Level RDL non Visula defects....

  • TDMS-1000
    - Standard HVM OS Tester for Small Pin Count(512ch, 1024ch, 2048ch and 3072ch System)
    - 2 wire(non-Kelvin) structure
    - 1PMU covers 768ch
    - Other pin level setting except for test pin : OPEN/GND/VT1/VT2
    - Expansion slot(Option): DPS, LC, Vector Pattern
    - Domestic & International companies Qualified

    - Standard HVM OS tseter for High pin count (1024ch, 2048ch and 4096ch System)
    - Measure pin mode : 2 Wire normal mode / 4 wire Kelvin mode
    - Other pin level setting except for test pin : OPEN/GND
    - 1PMU covers 64ch
    - Max. 8192ch available
    - Expansion slot(Option): DPS, LC, Vector Pattern

  • 80um pitch TF MLO
    Fine pitch solution - C4 80um Pad (Bump) pitch. Mems Technology Thin film Stactup Process. Short delivery and Turn Key solutions for Vertical Probe card....

  • 1. C4 Pad Pitch  : 80um
    2. Thickness : 1T // 1.5T // 2.5T
    3. Layer : Thinfilm 3 layer + MLO 6 layers
    4. Mems Technology Thin film Stackup process
    5. Short delivery than conventional MLO 
    6. TurnKey Solution (Design +PCB FAB+MLO FAB+Probe Card assembly)
  • Extreme Temperature TIB(Test Interface Board)
    TSE Interface board specialized in Extreme Temperature Package Test....

  • Extreme Temperature Test has been required in the Memory Test Envoironment.
    TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.

     Extreme Temperature TIB(Test Interface Board)
     -. Extreme temperature Connector developed
      -. Docking Epoxy Frame Material developed
      -. Direct Cooling Interface Board developed
         ≫ Coolant, Direct Active IC Cooling
         ≫ Component Antioxidants
         ≫ Temp. Reduced stabilization time

  • V93K Direct Docking Mems Probe card
    Improve CCC than conventional Cobra Probe! Good reliability probing planarity as Mems technology. Various Direct docking wafer probing solutions!...

  • 1. Probe : MEMS Cobra Pin (60x60um Cobra type)
    2. Contact force : 1.2gF/mil
    3. CCC : 950mA
    4. Square hole type Housing (70x70um) 
    5. Life time 1,5kk
    6. Direct docking solution (V93K, Uflex)
    7. Easy Replacement and Repair
    8. Turn key Solution (PCB+MLO+Probe Head assembly)

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and Fairguide.com or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.

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