CyberOptics Corporation

Minneapolis,  MN 
United States
http://www.cyberoptics.com
  • Booth: A418


CYBEROPTICS; Technology Leadership. Global Solutions.

CYBEROPTICS IS A GLOBAL LEADER

In High-Precision 3D Sensors that Significantly Imporve Yiedls and Productivity in the Industrial Metrology, Surface Mount Technology (SMT) & Semiconductor Marets.

Vision

To be the global technology leader in high precision 3D sensors.

Strategy

Deliver profitable growth by developing and manufacturing high precision proprietary 3D sensors and leveraging them in key vertical markets.

About CyberOptics Corporation

CyberOptics Corporation (NASDAQ: CYBE) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics sensors are being used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of its key vertical segments. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.


 Products

  • WaferSense® Auto Gapping System
    Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. ...

  • Improve Uniformity and Yield with WaferSense AGS for Accurate and Repeatable Setups

    Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch. Improves uniformity, tool availability and repeatability.

    Achieve the ideal set-up for your equipment by measuring gaps at three points.

    Achieve exactly the gap you need, whether you need to set a gap that is perfectly parallel or slightly tilted to achieve the best uniformity. The three AGS sensor each report separate readings from chambers at process pressure in numerical and graphical form to let you achieve exactly the gap you need.

    Improve tool-to-tool process uniformity with objective and repeatable gap adjustments.

    Have peace of mind by taking the human variable out of adjusting your equipment with objective (numerical) measurements. Make the right adjustments time after time with numerical and graphical displays. Improve tool-to tool process uniformity by enabling anyone to set the same gap across the tools.

    Reduce equipment calibration time through live feedback.

    See the effects of adjustments in real-time with GapView™ software’s graphical user interface, provided with AGS. Numerical and graphical measurements can be taken from inside an evacuated process chamber with a clear indication when equipment settings are within tolerance.

    Speed setups, maintenance and troubleshooting with automatic handling.

    Available in 200mm and 300mm wafer sizes.

    Features

    • Wafer-shaped. Available in 200mm and 300mm wafer sizes.
    • Highly accurate. Measures gaps with +-25 micron accuracy within 4 hours of field offset calibration. Gap resolution +-5 microns.
    • Wireless. No wires that can break after repeated use and AGS will never be misaligned by strained wires. Transmit data in real-time.
    • Easy-to-use software. GapView and GapReview application software displays numerical and graphical information. Each graphic is color coded to make it easier to see when the gap is above, below or within the user-defined target gap range. GapView lets you log time-stamped measurements to a CVS file for documentation and/or analysis.
  • WaferSense® Auto Teaching System
    “Sees” inside equipment to capture three dimensional offset data (x, y, and z) to quickly teach wafer transfer positions with accuracy to 100um....

  • Capture three dimensional offset data (x, y and z) to quickly teach wafer transfer positions.

    Improve yields and lower particulate contamination with accurate wafer handoff calibration.

    Capture offset data for accurate calibration of transfer positions as the wafer-like ATS moves through your semi-conductor equipment. Improve the yield of your manufacturing process with calibrated equipment.

    Achieve repeatable and reproducible semiconductor equipment setups.

    Eliminate technician-to-technician variation with the ATS calibration process enabling repeatable and reproducible setup and maintenance checks.

    Reduce equipment downtime from hours to minutes.

    Troubleshooting takes less time with the wireless and vacuum compatible ATS, as equipment stays sealed during inspection. Increase equipment availability and reduce manpower and consumable expense.

    Speed trouble-shooting and lower consumable expense with visual inspection.

    Receive real-time images as robots move ATS through the tool. An intuitive graphical user interface provides x, y and z offsets that eliminate guesswork. Search for lost wafers and verify that pedestals are free of debris without opening the tool.

    Features

    • Wafer-shaped. Available in 200mm and 300mm wafer sizes.
    • Highly accurate. Accurate to +-0.1mm (+-0.004) x and y position; +-0.5mm (+-0.02) z position.
    • Wireless and vacuum compatible. Travels like a wafer and takes less time as equipment stays sealed during inspection. Transmits data in real-time.
    • Easy-to-use software. TeachView and TeachReview application software displays live video and measurements based on user defined targets, and logs offsets and user comments.  TeachTarget programs the teaching wafer to find circular features.
    • On-board camera. On-board image processor reports x-y-z offset from the teaching wafer to a target inside the equipment so you can teach wafer transfer coordinates.
  • WaferSense® Auto Multi Sensor™
    Speed equipment qualification with wireless measurements....

  • Speed vibration, leveling and humidity measurements with all-in-one measurement device. Improve yields.

    Speed equipment qualification with wireless measurements.

    Collect and display acceleration, vibration, leveling and humidity data. Monitor humidity in wafer environments. Use the Auto Multi Sensor with MultiView™ and MultiReview™ software for real-time equipment diagnostics.  See the effects of adjustments in real-time, speeding equipment alignment and set-up.

    Shorten equipment maintenance cycles with thin and lightweight wafer-like form factor.

    Thinner 3.5mm form factor provides access to more chambers. Operates at higher temperatures. Keep the process areas unexposed to the fab environment with vacuum compatible AMS.

    Lower equipment maintenance expenses and enhance process uniformity with objectiveand reproducible data.

    Take the human element out of adjusting your equipment with objective measurements for multiple applications in one. Make the right adjustments time after time. Receive early warning for impending equipment failures and optimize your preventative maintenance plans.

    Features

    • Wireless, wafer-shaped and battery-powered. Available in 150mm, 200mm, 300mm.
    • Reports inclination in three dimensions. x, y and vertical
    • Reports Accelerations in three dimensions. x, y and z
    • Humidity accuracy. +/- 2% RH
    • Thin. 4.5mm thick
  • ReticleSense® Airborne Particle Sensor
    Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14um within semiconductor process equipment and automated material handling systems....

  • Improve equipment set-up and long term yields by wirelessly monitoring airborne particles in real-time.

    Speed equipment qualification with wireless measurements.

    Collect and display particle data wirelessly using the APSR and Particle Spectrum™ software for real-time equipment diagnostics. Compare past to present as well as one tool to another with recorded particle data. Save time by swiftly locating contamination sources with the APSR data and see the effect of cleanings, adjustments and repairs in real time.

    Shorten equipment maintenance cycles with reticle-like form factor.

    Detect particles in real-time without opening the tool so you don’t need to expose process areas to the environment. APSR goes where reticles go to find the place where particles contaminate reticles. Once the location of particles is identified, tools may be selectively cleaned. Open only the dirty portion, keep the clean areas clean.

    Lower equipment expenses with objective and reproducible data.

    Raise your first-pass monitor reticle success, reduce your qualification expense and increase availability with APSR. Receive early warning for impending equipment failures and optimize your preventative maintenance plans. Establish a baseline from known clean tool, then cycle APSR through a candidate tool before committing monitor reticles.

    Features

    • Reticle-shaped.  Also available in 150mm, 200mm and 300mm wafer sizes.
    • Measures particles greater than .14 microns Reports particles in 0.1μm and 0.5μm bin sizes and larger particles in 2, 5, 10 and 30 μm bin sizes.
    • Wireless. Transmits data to your laptop of PC in real-time.
    • Easy-to-use software. ParticleSpectrum application software provides the user with real time visual feedback and can record and replay logged data for review and analysis.
  • PanelSense™ Airborne Particle Sensor™
    Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14μm within flat panel display manufacturing equipment. Enables simultaneous measurement using multiple APS-FPD devices. Includes ParticleSpectrum™ software....

  • The new APS-FPD improves equipment set-up and yields by wirelessly monitoring airborne particles in real-time for Flat Panel Display manufacturing.

    NEW ParticleSpectrum™ Software enables simultaneous measurement using multiple APS-FPD Devices.

    Quickly monitors, identifies and enables troubleshooting of airborne particles down to 0.14μm within flat panel display manufacturing equipment. Easily identifies when and where the particles originate.

    Speed equipment qualification with wireless measurements.

    Collect and display small and large particle data wirelessly using multiple APS-FPD devices and new ParticleSpectrum™ software for real-time equipment diagnostics.
    Compare past and present data as well as one tool to another easier and faster without opening an additional application, now with Review functionality integrated with ParticleSpectrum™.

    Shorten equipment maintenance cycles with flat panel device.

    Locates and measures the place where particles contaminate flat panel displays. Once the location of particles is identified, tools may be selectively cleaned.
    Save time by swiftly locating contamination sources and see the effect of cleanings, adjustments and repairs in real time.

    Lower equipment expenses with objective and reproducible data.

    Raise your first-pass monitor success, reduce your qualification expense and increase availability with APS-FPD.
    Receive early warning for impending equipment failures and optimize your preventative maintenance plans.
    Establish a baseline from known clean equipment, then use APS-FPD to qualify new or repaired equipment.

    Features

    • Designed for Flat Panel Display manufacturing. Available FPD form factor.
    • Measures particles greater than .14 microns Reports particles in 0.1μm and 0.5μm bin sizes and larger particles in 2, 5, 10 and 30 μm bin sizes.
    • Wireless. Transmits particle data to your laptop or PC in real-time. Enables simultaneous measurement using multiple APS-FPD devices.
    • Easy-to-use software. New ParticleSpectrum application software provides the user with real time visual feedback and can record and replay logged data for review and analysis.
  • MRS SENSORS
    Precision Optical Sensor 3D Vision Solutions For Metrology, Assembly and Process Improvement...

  • Measure. Analyze. Improve.

    CyberOptics Corporation has been an innovative supplier of precision optical sensor solutions to the manufacturers of automated assembly, inspection and metrology equipment for over 30 years. Our 2D and 3D vision solutions are used in manufacturing environments to increase operating efficiencies, production yields and quality. CyberOptics pioneering sensor technology provides our customers with a means to grow and strengthen their competitive positions as the demands for higher accuracy at faster production speeds increase.

    High Precision Accuracy with Proprietary Multi-Reflection Suppression (MRS) Sensor Technology

    Proprietary MRS sensor technology, deemed best-in-class, enables metrology-grade accuracy by inhibiting optical measurement distortions and reflections. At the heart of the world’s cell phone manufacturing inspection systems and used in various applications where highly accurate inspection is critical.

    Multi-Reflection Suppression (MRS) Sensor Technology integrated into Systems in Key Segments

    MRS Sensor for SQ3000 3D AOI System

    CyberOptics’ breakthrough 3D sensing technology comprising four multi-view 3D sensors and a parallel projector delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images, accurate to sub 10 µm at production speed. Unmatched accuracy is achieved with the revolutionary MRS sensor technology by meticulously identifying and rejecting reflections caused by shiny components and reflective solder joints. Effective suppression of multiple reflections is critical for accurate measurement making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

    Ultra-High Resolution MRS Sensor for SQ3000 3D AOI

    CyberOptics has advanced the proprietary Multi-Reflection Suppression (MRS) sensor to an even finer resolution with an accuracy of 7µm. The Ultra-High Resolution MRS sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical

    MRS Sensor for SE3000 3D SPI

    The new SE3000 3D SPI system is the world’s first SPI system to incorporate the industry-leading Multiple-Reflection Suppression (MRS) technology with a finer resolution for the best accuracy, repeatability and reproducibility – Even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, solder paste inspection has reached a new level of precision for the most stringent requirements.
    3D Scanning Inspection and Metrology

    MRS Sensor for CyberGage360

    CyberGage360’s patented algorithms combine tremendous amounts of data into a single coordinate system using high-precision encoder position feedback for mechanical metrology-grade part measurement. No best fit piecing together of scan regions is used as is common in competitive projection scanning systems. The resulting part measurement provides NIST traceable system accuracy to 7 µm + L/10000, and repeatability to 5 µm. MRS suppresses the reflections caused by reflective surfaces better than any other projection scanning technology using the patented algorithms and optics born of MRS technology, resulting in a highly precise scan. The MRS sensor incorporated into the CyberGage360 system utilizes two dual camera optical blue light scanning sensors mounted above and below the subject part sitting on an optically flat, clear glass plate calibrated for scanning. The glass plate allows simultaneous data capture from both sensors and eliminates the need to flip-over the part necessary for all other scanning and other conventional measuring systems. CyberGage360 can be used on the factory floor, in the inspection lab, or for incoming parts inspection

    MRS Sensor for Coordinate Measurement SQ3000 CMM

    SQ3000 CMM utilizes CyberCMM™, a comprehensive software suite of coordinate measurement tools that provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed in less than an hour for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMM) s.

    SQ3000 3D CMM offers unmatched accuracy with the advanced MRS technology by meticulously identifying and rejecting reflections caused by shiny components making MRS an ideal technology solution for a wide range of applications including those with very high quality requirements.

    The Ultra-High Resolution MRS sensor enhances the SQ3000 CMM platform, delivering superior performance ideally suited for Socket Metrology and micro-electronics applications where an even greater degree of accuracy and inspection reliability is critical.

    Back-End Semi Packaging Inspection

    MRS Sensor for Semiconductor

    CyberOptics is an OEM supplier of proprietary MRS sensors to to KLA-Tencor (NASDAQ: KLAC) for KLATencor’s® BEOL package inspection systems.

    High Speed 2D and 3D Sensor Solutions

    • Metrology grade 3D accuracy at production speeds
    • Sensors that can acquire over 100 million 3D measurements per second
    • On-The-Fly measurement and inspection technology

    Manufacturing Process Improvement

    • Inspection solutions that provide real-time feedback for product and process quality control
    • Increased equipment up-time and throughput

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