Welcome to Disco
DISCO leads the industry in dicing, grinding and polishing
technologies. Our dicing equipment is comprised of lasers,
singulation, semi-automatic, fully automatic, single and
dual spindle saws. Materials we work with include silicon,
GaAs, low-k, ceramics, glass and others.
Grinding equipment consists of semi-automatic, and
fully-automatic grinders capable of ultra-thin grinding,
while dry polishers and plasma etchers address stress relief
and surface preparation.