An in-line system which achieves stable and high speed processing of ultra-thin wafers. Performs the entire process from grinding to polishing, wafer mounting, and the peeling of the front side protective tape.
1. Φ300mm wafer thinning
2. Stable processing of wafers less than 25um thick
3. High throughput
4. Various Z3 axis applications
5. Configured for applying 2-in-1DAF (Die Attach Film)