DHK Solution Corporation

Korea (South)
  • Booth: A244

Welcome to Disco

DISCO leads the industry in dicing, grinding and polishing
technologies. Our dicing equipment is comprised of lasers,
singulation, semi-automatic, fully automatic, single and
dual spindle saws. Materials we work with include silicon,
GaAs, low-k, ceramics, glass and others.

Grinding equipment consists of semi-automatic, and
fully-automatic grinders capable of ultra-thin grinding,
while dry polishers and plasma etchers address stress relief
and surface preparation.


    Flagship Model Equipment with Expandability for Diverse...

  • Flagship Model Equipment with Expandability for Diverse Manufacturing Processes

    1. Fully automatic dicing saw which suppouts the world's narrowest width, 300mm
    2. High Expandibility
     - Specifications which enables the use of both frame and wafer transferring
     - ABC(Auto Blade Changer)
       :Prevents blade mounting errors and faiilures during blade recplacement
       :Improves traceability of the blades used to process worklieses
    3. Basic Function Improvements
     -Stabilizes processing by increasing the torque from 1.2kW with a newly developed 1.8kW spindle
     -Reduces processing time by optimizing the axis operations using multiple-axis synchronous controls
     -Reduces measurement time by Improving the measurement accracy using a newly developed NCS(Non-contact Setup)

    Higher throughput grinder polisher for 300 mm wafers...

  • An in-line system which achieves stable and high speed processing of ultra-thin wafers. Performs the entire process from grinding to polishing, wafer mounting, and the peeling of the front side protective tape.

    1. Φ300mm wafer thinning
    2. Stable processing of wafers less than 25um thick
    3. High throughput
    4. Various Z3 axis applications
    5. Configured for applying 2-in-1DAF (Die Attach Film)

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