3 minutes 20 seconds. That’s the record time announced in October 2019 by Google and the University of California, Santa Barbara (UCSB) to perform a calculation with a Sycamore quantum processor. A calculation that would have taken the most powerful computers 10,000 years. SET with its FC150 Flip-Chip Bonder was part of this recent achievement.
Qubits Interconnected thanks to the FC150 Flip-Chip Bonder
On October 23, 2019, Google announced a quantum breakthrough with the video Demonstrating Quantum Supremacy. The video was viewed more than 2 million times on YouTube in its first 24 hours. The FC150 appeared in the video as engineers were performing tasks.
In an article jointly published by Google and UCSB in November 2017, the SET FC150 was cited as it was used to align and assemble a chip with a base substrate at room temperature with micrometric precision. This is part of a process that interconnects qubits - storage units specific to quantum computing.
FC150: a Flip-Chip Bonder for Advanced R&D
With an accuracy of ± 0.5 μm, ± 1 μm after welding, the SET FC150 offers a wide variety of welding techniques, with configurations ranging from manual to all-automatic.
With parallelism adjustment, aligning and soldering of components ranging in size from 0.2 to 100 mm, the FC150 meets almost all requirements for high-end welding applications, including reflow, thermocompression, bonding and fusion welding.
The FC150 in detail