AP SYSTEMS CORPORATION

[Introduction]
Rapid Thermal Processing (RTP) equipment that treats wafers at high temperatures within a short period of time using a tungsten halogen lamp is applied to the oxidation process.
The advantage of RTP is that it can quickly heat or cool the temperature, which can significantly reduce heat consumption costs.
The RTP equipment of the AP system provides excellent temperature uniformity, wafer rotation, radiation compensation, and intelligent temperature control.
 

[Features/Strengths]
• Chemical resistance
• Preventing contamincation & Particle& Fast purging
• Preventing wafer warpafe and stress
• Stable Spike Anneal Repeatability
• Stable Wafer Rotation
• Reflector Plate or Baseplate
• Temperature Controller (DSP)
→ Enhanced Temp.uniformity
• Reduced Cell Contamination in the O2 Analyzer
• In-house solution for Power Control
• Human Safety

[Introduction]
Rapid Thermal Processing (RTP) equipment that treats wafers at high temperatures within a short period of time using a tungsten halogen lamp is applied to the oxidation process.
The advantage of RTP is that it can quickly heat or cool the temperature, which can significantly reduce heat consumption costs.
The RTP equipment of the AP system provides excellent temperature uniformity, wafer rotation, radiation compensation, and intelligent temperature control.

[Function/enhancement]
• Low pressure gas flow control
• Controlling the distribution of film quality in wafers
• High temperature heat source control window
• Low pressure, high temperature process
• Contamination and particle protection
• Adjustable gas injector
• Stable wafer rotation
• Wafer distortion and stress prevention
• EFEM (protective rod, wafer scratch prevention, etc.)

[Introduction]
KORONA^TM PVD600 series is for the process of depositing various metal thin film act as a barrier, adhesion, seed for Electro-Chemical Plating and etc. The system is applicable to UBM and RDL process for wafer-level and panel-level package.
KORONA^TM PVD600 series consist of multi-degassing, precleaning and sputtering modules for depositing UBM/RDL seed layers in advanced packaging. Through a unique approach to wafer degassing, the cost of ownership savings can get more than 30%.

[Function/enhancement]
• Deposition Process
• Precleaning Process

[Introduction]
DSC300 System is for the process of cleaning scum after Photo resist develop for high yield electroplating and surface modification for improved adhesion.
 Using a specific ICP plasma source & simple chamber design, it performs wide process window without plasma damage on substrate and reduces cost for system maintenance

[Function/enhancement]
• High Etch Rate
• High Throughput
• Uniformity Control
•Plasma Stability

[Introduction]
KORONA™ CVD Series is for the process of depositing various thin film such as SiN_x, SiO_x, SiON.  Various film depositions are possible and performance is secured to meet customer needs.
The wide process window allows running a variety of processes that meet customers needs and respond promptly to customer's requests with accumulated know-how through testing.

[Function/enhancement]
• Superior Process Control
• Excellent Process Repeatability
• Low Temperature Process
• Plasma Stability
• Easy system maintenance