The company is actively driving innovations that important value the intersection of chemical, physical and biological sciences to help building up advanced chemicals and materials to support various Semiconductor / LED / LCD / Solar Cell markets.
Bump Photoresist
Positive type bump Photoresist : YPB-10K
Negative type Bump Photoresist : YBNP-S500
I-Line Photoresist
Negative PR for 365nm process: YNP-100, YNP-650, YCIN-1113, YCIN-2616, TDNP-203B, AYCIN-5315, AYCIN-5230
Positive PR for 365nm process: YCIP-1100, YCIP-1300, YCIP-1700, YCIP-4000E
KrF Photoresist
Positive PR for 248nm process : AYCKP-9160, YCKP-3560
Negative PR for 248nm process : YCKN-2954, YCKN-540S, YCKN-4530
Transparent Photoresist
Transparent photoresist: YTNP-2005, YTNP-2015, YTNP-2030
TSV i-line Thick Photoresist
Positive PR TSV: YPP-T10K
BARC
Bottom anti-reflective coating materials for the 193nm process: YCB-240, YA-400, YA-600A, YA-800
TARC
Top Anti Reflective Coating Materials for 248nm process : YCTA-9047
Developer
Developer for Semiconductor : DV-7000D, DE-Y2200, DV-400, DV-400S
Developer for C/F Resist(TMAH Type) : DE-Y250L
UV Imprint Resin
UV imprint resin: YNIL-R1, YNIL-R2, YNIL-R3
Resin for polymer mold (stamp): YNIL-M1, YNIL-M2, YNIL-M3
Hybrid resin: YNIL-HR
Rinsing Solution
Rinsing Solution for KrF Photoresist : ATL-1008
Rinsing Solution for ArF Photoresist : PLECT-100, PLECT-200
Rinsing Solution for EUV Photoresist : YEPR series
Cap anti-leaning Material : ALS ? Y957
Spin On Carbon Hardmask
Hot-Temperature Spin On Carbon Hardmask : YHS-140, YCHS-3814, YCHE-3731, YCHS-4359, AYCHS-2819
Normal Spin On Carbon Hardmask : YS-210
Stripper
Stripper for removal of Al post etch residue : YMR-1600, YMR-1700
Metal stripper for Semiconductor (Batch Type) : YGR-4100AL-R
Metal stripper for Semiconductor (Single Type) : YGR-8100AL, YGR-8200AL
CMP
CMP slurry for 3D Nand Flash Memory : NTS-300
CMP slurry for Copper Barrier Metal : SD-100
Copper Post CMP Cleaner : YPCC-200