Rapid Thermal Processing (RTP) equipment that treats wafers at high temperatures within a short period of time using a tungsten halogen lamp is applied to the oxidation process.
The advantage of RTP is that it can quickly heat or cool the temperature, which can significantly reduce heat consumption costs.
The RTP equipment of the AP system provides excellent temperature uniformity, wafer rotation, radiation compensation, and intelligent temperature control.
• Low pressure gas flow control
• Controlling the distribution of film quality in wafers
• High temperature heat source control window
• Low pressure, high temperature process
• Contamination and particle protection
• Adjustable gas injector
• Stable wafer rotation
• Wafer distortion and stress prevention
• EFEM (protective rod, wafer scratch prevention, etc.)