Welcome to Hesse Mechatronics at Booth D904!
Hesse GmbH, founded in 1978, is a world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse GmbH designs and manufactures high speed fine pitch/thin wire wedge bonders, heavy wire bonders, smart welding machines and complementary equipment for semiconductor backend assembly.
For detail information, please visit our website: https://www.hesse-mechatronics.com/en/
Smart Welder SW955/9 and Smart Welder SW1185 combine the best technology of Ultrasonic Welding Equipment and Wire Bonding Machines.
Thin Wire Bonder
Bondjet BJ855 is benchmarked for large working area, high bonding speed and ball-wedge, wedge-wedge bonding capability.
Heavy Wire Bonder
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding ribbons for applications like power modules, IGBT, automotive devices, etc.
More to come
Detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #D904