Hesse Asia Limited

  • Booth: D904

Welcome to Hesse Mechatronics at Booth D904!

Hesse GmbH, founded in 1978, is a world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse GmbH designs and manufactures high speed fine pitch/thin wire wedge bondersheavy wire bonderssmart welding machines and complementary equipment for semiconductor backend assembly.

For detail information, please visit our website: https://www.hesse-mechatronics.com/en/

Smart Welder
Smart Welder SW955/9 and Smart Welder SW1185 combine the best technology of Ultrasonic Welding Equipment and Wire Bonding Machines

Thin Wire Bonder
Bondjet BJ855 is benchmarked for large working area, high bonding speed and ball-wedge, wedge-wedge bonding capability.

Heavy Wire Bonder
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding ribbons for applications like power modules, IGBT, automotive devices, etc. 

More to come

Detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #D904


  • Fine Wire Bonder Bondjet BJ855
    High Speed Fully Automatic Fine Wire Bonder (Wedge-Wedge and Ball-Wedge)...

  • Bondjet BJ855 is the latest generation of fully automated fine wire bonders (wedge-wedge and ball-wedge bonding) and is benchmarked for the :

    • Fastest bonding speed 
    • Largest working area with deep access capability
    • Greatest looping stability

    Visit our website for more information of Bonder BJ855: https://www.hesse-mechatronics.com/ 

  • Smart Welder SW1185
    Best of ultrasonic welding & wire bonding technology....

  • Smart Welder SW1185 has the biggest working area in the market with below advanced features: 

    • Automotive quality control (PiQC)
    • Soft touchdown & accurate positioning
    • Dynamic Bond Force Control
    • Individual parameters per spot
    • Tailor-made Automation solution

    Visit our website for more information of Smart Welder SW1185: https://www.hesse-mechatronics.com/

  • Smart Welder SW955/959
    Best of both Technologies: ultrasonic welding & wire bonding...

  • Smart Welder SW955/SW959, different table sizes for your application selection

    Visit our website for more information of Smart Welder SW955/959: https://www.hesse-mechatronics.com

  • Heavy Wire Bonder Bondjet BJ955/959
    Fully Automatic Heavy Wire Wedge Bonde...

  • Wire bonder Bondjet BJ955/959 are characterized by several new features:

    • Al/Cu wire & Ribbon bonding capability
    • Wear free piezo technology
    • Bondtool/ Wire spool detection
    • Multiple networking capability

    Visit our website for more information of Bonder BJ955/959: https://www.hesse-mechatronics.com/

  • Heavy Wire Bonder Bondjet BJ931
    Dual-Head Leadframe Wedge Wire Bonder...

  • The wire bonder Bondjet BJ931 is an ultrasonic wedge wire bonder developed especially for maxtrix leadframe applications. 

    Your benefits:

    • Highest UPH in the market
    • Interchangable bondhead between Al, Cu & Ribbon
    • Bond quality monitoring replacing pull tester
    • Small footprint

    Visit our website for more information of Bonder BJ931: https://www.hesse-mechatronics.com

  • Heavy Wire Bonder Bondjet BJ985
    Fully Automatic Heavy Wire Wedge Bonder...

  • Wire bonder Bondjet BJ985 is characterized by several new features:

    • Highest UPH in the market
    • Interchangable bondhead between Wire & Ribbon
    • PiQC, Bond quality monitoring replacing pull tester
    • Dual lane with zero indexing time

    Visit our website for more information of Bondjet BJ985: https://www.hesse-mechatronics.com/

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and Fairguide.com or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.

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