The purpose of the FOUP Inspection System is to inspect the appearance and interior of the FOUP for Broken, Crack, Wafer powder residue, damage, deformation, etc. to prevent any defect in the Wafer due to defective FOUP in advance.
Detailed inspection items are shown below.
ⓐ FOUP Inside : Wafer Removed / Slot Pitch, Width / Damage, Pieces of Broken Wafer
ⓑ FOUP Door : Retainer Tips Damage, Pitch / Gasket Damage, Position
ⓒ FOUP Top : Handling Flange Missing Screw / Handling Flange Damage
ⓓ FOUP Bottom : Missing Screw / Broken, Crack, Damage
ⓔ FOUP Side : Handle Damage / Fixed Latch Damage