EV Group Korea Ltd.

Korea (South)
  • Booth: A544

Welcome to visit us at Booth #A544 for EV Group (EVG).

EV Group(EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, U.S. and Japan, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base?  the initial development through to the final integration at the customer’s site. Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world.
More information about EVG is available at www.EVGroup.com.


    Automated Production Wafer Bonding System Integrated platform for high precision alignment and fusion bonding...

  • Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVGs GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.

    New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
    Up to six pre-processing modules like: Clean module
    LowTemp™ plasma activation module
    Alignment verification module
    Debond module

    XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
    Optional features: Debond module
    Thermocompression bond module

  • IQ Aligner® NT
    Automated Mask Alignment System The IQ Aligner® NT is optimized for zero-assist contactless proximity processing at highest throughput....

  • The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

    Zero assist bridge tool - dual substrate concept supporting flexibility of production for 200 mm and 300 mm
    Throughput > 200 wph (first print)
    Cutting-edge alignment accuracy
    Top-side alignment down to 250 nm
    Back-side alignment down to 500 nm
    Broadband intensity > 120 mW/cm² (300 mm wafer)
    Full Clearfield Mask Movement (FCMM) for flexible pattern positioning and compatibility for darkfield mask alignment
    Contact-free in-situ mask-to-wafer proximity gap verification
    Excellent run-out compensation thanks to ultra-flat and fast response temperature-controlled wafer chuck
    Manual substrate loading capability
    Rework sorting wafer management and flexible cassette system
    Remote tech support and GEM300 compatibility
    Smart process control and data analysis feature [Framework Software Platform]
    Integrated analysis features for process and machine control
    Equipment and process performance tracking feature
    Parallel/queueing task processing feature
    Smart handling features
    Occurrence and alarm analysis
    Smart maintenance management and tracking

    Automated Production Fusion Bonding System Enabling 3D Integration for More Moore...

  • EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

    BONDSCALE is being sold alongside EVGs industry benchmark GEMINI FB XT automated fusion bonding system, with each platform targeting different applications. While BONDSCALE will primarily focus on engineered substrate bonding and layer-transfer processing, the GEMINI FB XT will support applications requiring higher alignment accuracies, such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning.

    Fully automated fusion/molecular wafer bonding applications on 200 mm and 300 mm substrates in a single platform
    Direct wafer bonding with plasma activation for heterogeneous integration of different materials, high-quality engineered substrates as well as thin-silicon layer-transfer applications
    Layer-transfer processes and engineered substrates enabling logic scaling, 3D integration such as M3, 3D VLSI including backside power distribution, N&P stacking, logic-on-memory, clustered functional stacks and beyond-CMOS adoption

  • EVG®560
    Automated Wafer Bonding System Fully automated wafer bonding system for high-volume manufacturing...

  • The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVGs manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

    Fully automated processing with automated loading and unloading of bond chucks
    Up to four bond chambers for various bonding processes
    Compatible with EVG mechanical and optical aligner including SmartView
    Simultaneous rapid heating and cooling on top and bottom side
    Automatic loading and unloading of bond chambers and cooling station
    Remote online diagnostics

  • EVG®40 NT
    Automated Measurement System Versatile, high-accuracy metrology for bonding and lithography...

  • The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy.
    Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
    With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.
    As an application example, the EVG40 NT completes EVG’s product range for highly accurate aligned wafer bonding as the tool of record for reliably verifying the 100 nm bond overlay accuracy of EVG’s GEMINI FB automated fusion.

    Versatile measurement options for lithography and bonding metrology
    Alignment verification for bonding and lithography applications
    Top- to bottom-side microscope for manifold measurement methods
    Critical dimension (CD) measurement
    Die-to-die alignment verification
    Multi-layer thickness measurement
    High measurement accuracy in vertical and lateral direction
    High throughput due to specialized calibration routine
    PC-based measurement and pattern recognition software for highest reliability


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