FST (Fine Semitech Corp.)

Hwaseong-si,,  Gyeonggi-do 
Korea (South)
http://www.fstc.co.kr/eng/
  • Booth: D124


Welcome to visit our site and we appreciate!

We will lead the global market with innovative technologies and distinguished quality competitiveness. 

Since its establishment in 1987, FST has been committed to supplying high quality products to high-end semiconductors and FPD industries. We have achieved continuous growth in the pellicle business, one of the main materials used in the semiconductor and FPD manufacturing process, and the chiller, which controls the temperature and humidity of various equipment. FST has also innovated self-developed optical inspection systems to secure competitiveness in newly developed products related to semiconducting.

For the last 31 years, FST has made every effort to meet customers’ expectations and striven to advance its technologies. Our focus is to be the most competitive supplier in the global market with our distinguished and uncompromising quality and services.

FST will always do its very best to improve the value of our products and services for our customers’ satisfaction.

Thank you.


 Products

  • Pellicle
    A pellicle is a thin membrane stretched over an aluminum frame and glued to the photomask to protect it from contaminants, such as particles....

  • A pellicle is a thin membrane stretched over an aluminum frame and glued to the photomask to protect it from contaminants, such as particles. Even if particles sit on the membrane, they are not printed on the wafer because they are out of focus during the exposure from the lithography process. 

    Purpose of Use

    • To improve the yield rate of IC chips

    • To extend the cleaning period of the photomask

    • To protect the photomasks from contamination

    • To extend the lifetime of the photomask

    • To isolate sources of contamination

  • Chiller
    The Chiller of FST is an equipment that improves process efficiencies by constantly maintaining inside-chamber wafer and its surrounding temperatures, through the excessive heat produced in semiconductor etching process....

  • The Chiller of FST is an equipment that improves process efficiencies by constantly maintaining inside-chamber wafer and its surrounding temperatures, through the excessive heat produced in semiconductor etching process. As the process becomes more micro and solid, continuous development of Chiller is requested for more customized equipment supply. Accordingly, products of various fundamental technology and design technology basis are being manufactured.

    • Thermoelectric Chiller
      • Momentary Power Outage Resistance (Power Vaccine) 
      • High Efficiency(Hiper) TEM & Block 
      • Compact Size & User-friendly Structure 
      • High Accuracy & Fast Response Temperature Control (±0.01℃) 
      • IGBT Circuit, Non-defective SMPS 

    • Compressor-type Chiller
      • High-reliability Refrigeration Components and Cycle 
      • Low Noise, Low Power Circulation System (50% Reduction) 
      • Momentary Power Outage Resistance (Power Vaccine) 
      • Energy-saving Refrigeration System (60% less power) 
      • Seismic & Vibration-resistance Design 

    • Heat Exchanger
      • High-reliability Components and Sensors 
      • Low Noise, Low Power Circulation System (50% Reduction) 
      • Momentary Power Outage Resistance (Power Vaccine) 
      • Precision Control 3-Way Valve (±0.01℃) 
      • Seismic & Vibration-resistance Design 

    • Cryogenic Chiller
      • High-reliability System under Cryogenic Condition (Dew condensation, Freezing Prevention) 
      • Rapid Cooling and Maintaining (20 ▶ -80℃, 10min.) 
      • Momentary Power Outage Resistance (Power Vaccine) 
      • Special Refrigeration System Extra Low Temperature (7kW@-70℃) 
      • Seismic & Vibration-resistance Design 

    • THC (Temp & Humidity Controller)
      • Energy Saving Refrigeration System (60% Reduction) 
      • Temperature / Humidity Stability (±0.01℃ / ±0.2%)        
      •  Momentary Power Outage Resistance (Power Vaccine) 
      • DI Supply Stabilization System 
      • Seismic & Vibration-resistance Design 

  • DUV Solution (R&D)
    In addition to FST's legacy businesses - pellicle and temperature control units,FST's Tech Center develops next-generation technologies to prepare for the future....

  • Optical Pellicle & Mask Inspection System
    • Low cost of ownership (minimized consumable parts)
    • Pellicle / mask inspection (mask chamfer and side)
    • Patented algorithm for accurate detection
    • Full area inspection on membrane
    • User-friendly recipe creation
    • A.D.R (Automatic Defect Review)
      • Automatic review function
      • Discern whether particle is located front/back side of the membrane
  • EUV Solution (R&D)
    By providing cutting-edge EUV solutions to our customers, we will strive to become the world's renownedEUV solution provider....

  • FST's Tech Center develops next-generation technologies to prepare for the future.
    In collaboration with various institutions, we focus on technologies related to infrastructure tools and modules needed for EUV lithography. By providing cutting-edge EUV solutions to our customers, we will strive to become the world's renowned EUV solution provider.

    •  EUV Pellicle Mount / Demount system
      • Application
        • Fully Automated EUV Pellicle Mounting & Demounting
      • Key Features
        • High throughput
        • Automation
          • EUV mask auto track in/out by supporting OHT (OHT : Overhead Hoist Transport)
          • EUV pellicel stock & retrieve (Auto EUV pellicle case open with unclipping)
        • Precise process control
          • Glue dispensing control: shape & volume monitoring
          • Fine heat-temperature control: stud fixation & removal process
          • Various vision monitoring tools: preventing pellicle breakage during mounting & demounting process
        • Small footprint
    • EUV Pellicle Inspection System
      • Application
        • EUV Pellicle & Pelliclized EUV Mask Inspection
      • Automation
        • EUV mask auto track in/out by supporting OHT (OHT: Overhead Hoist Transport)
        • EUV pellicle stock & retrieve (Auto EUV pellicle case open with unclipping)
        • Automatic defect review
        • Automatic defect classification on pellicle membrane (front side, back side, hole)
      • Support various application of inspection for EUV Pellicle and/or pelliclized  EUV Mask
        • Incoming EUV Pellicle quality control: Inspection defectivity & mechanical strength
        • Pellicle status monitoring: Membrane stability after certain number of shots by scanner
        • Mask exterior inspection: backside, edge & etc.
    • EUV POD Inspection System
      • Application
        • Inspection annd measurement of EUV inner PODs
      • Key Features
        • Inspection of various areas
          • Diverse altitude, mask support pin, square/round holes, inner wall 
          • Identify incompletely plated area
        • Measurement
          • POD's parallelism & pitch between support pins
        • Addtional Functions
          • Removal of particles (N2 blowing & suction)
          • POD stocking
          • POD's status monitoring
    • EUV Source Generation System
      • Applcation
        • Mask defect review system
        • EUV transmittance/reflectance measurement system
        • EUV  interferometer
        • Coherent scattering microscopy
      • Key Features
        • High-order Harmonic Generation driven by ultra-fast laser
          • Excellent coherence
          • Low divergence
          • Table-top size footprint
          • Tunable wavelength

  • FPD Solutin (R&D)
    Model name PEGASUS-85S uses Raman Spectroscopy technology combined with large stage handling and positioning technology so that the tool can directly analyze the particle component and structure on the large size glass, 8.5 generation....

  • FST has developed Raman Spectroscopic Microscope for the large flat panel display industry, for the first time in the world. Model name PEGASUS-85S uses Raman Spectroscopy technology combined with large stage handling and positioning technology so that the tool can directly analyze the particle component and structure on the large size glass without any additional sample treatment for Raman analysis.

    Therefore the tool can dramatically reduce the Raman analysis time from previous 7 days to less than an hour and can eliminate the sample’s corruption during sample treatment and movement.

    PEGASUS-85S has a high NA 50x objective lens to analyze <1.0um particles and can adjust laser power with 256 steps by ND wheel. A 8.5 generation glass, 2500 mm x 2200 mm, can be loaded on the stage with the positioning accuracy <10um.

    When a particle’s spectrum is acquired, user can save the spectrum to the database and use it for spectrum comparison. As a result, with a good-prepared database, user can immediately identify any particle component in the database with PEGASUS-85S.

    Laser Scanning Microscope (LSM)
    • Defect analysis and high resolution review system
    • Material / component structure analysis
    • Thin film analysis: uniformity, material characteristic/properties
    • Noncontact, nondestructive analysis

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